Intel Celeron 1047UE vs AMD Athlon II Neo K345

Comparative analysis of Intel Celeron 1047UE and AMD Athlon II Neo K345 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Celeron 1047UE

  • CPU is newer: launch date 2 year(s) 0 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • Around 42% better performance in PassMark - CPU mark: 748 vs 527
Specifications (specs)
Launch date 1 January 2013 vs 18 December 2010
Manufacturing process technology 22 nm vs 45 nm
Benchmarks
PassMark - CPU mark 748 vs 527

Reasons to consider the AMD Athlon II Neo K345

  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 42% lower typical power consumption: 12 Watt vs 17 Watt
  • Around 5% better performance in PassMark - Single thread mark: 552 vs 526
Specifications (specs)
L1 cache 256 KB vs 128 KB
L2 cache 1024 KB vs 512 KB
Thermal Design Power (TDP) 12 Watt vs 17 Watt
Benchmarks
PassMark - Single thread mark 552 vs 526

Compare benchmarks

CPU 1: Intel Celeron 1047UE
CPU 2: AMD Athlon II Neo K345

PassMark - Single thread mark
CPU 1
CPU 2
526
552
PassMark - CPU mark
CPU 1
CPU 2
748
527
Name Intel Celeron 1047UE AMD Athlon II Neo K345
PassMark - Single thread mark 526 552
PassMark - CPU mark 748 527

Compare specifications (specs)

Intel Celeron 1047UE AMD Athlon II Neo K345

Essentials

Architecture codename Ivy Bridge Champlain
Launch date 1 January 2013 18 December 2010
Launch price (MSRP) $134
Place in performance rating 2931 2909
Processor Number 1047UE
Series Intel® Celeron® Processor 1000 Series AMD Athlon II Neo
Status Launched
Vertical segment Embedded Laptop

Performance

64 bit support
Base frequency 1.40 GHz
Bus Speed 5 GT/s DMI
Die size 118 mm
L1 cache 128 KB 256 KB
L2 cache 512 KB 1024 KB
L3 cache 2 MB
Manufacturing process technology 22 nm 45 nm
Maximum case temperature (TCase) 105 °C
Maximum core temperature 105 °C
Maximum frequency 1.4 GHz 1.4 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 1400 million
Front-side bus (FSB) 2000 MHz

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 16 GB
Supported memory types DDR3/DDR3L 1333/1600

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 900 MHz
Graphics max frequency 900 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size BGA1023 31mm x 24mm
Sockets supported FCBGA1023 S1
Thermal Design Power (TDP) 17 Watt 12 Watt

Peripherals

Max number of PCIe lanes 1
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 & 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
PowerNow
VirusProtect

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
AMD Virtualization (AMD-V™)