Intel Celeron 1047UE vs AMD Athlon Neo X2 L325
Comparative analysis of Intel Celeron 1047UE and AMD Athlon Neo X2 L325 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron 1047UE
- CPU is newer: launch date 3 year(s) 3 month(s) later
- Around 11% higher maximum core temperature: 105 °C vs 95 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 6% lower typical power consumption: 17 Watt vs 18 Watt
- Around 35% better performance in PassMark - CPU mark: 748 vs 556
| Specifications (specs) | |
| Launch date | 1 January 2013 vs 10 September 2009 |
| Maximum core temperature | 105 °C vs 95 °C |
| Manufacturing process technology | 22 nm vs 65 nm |
| Thermal Design Power (TDP) | 17 Watt vs 18 Watt |
| Benchmarks | |
| PassMark - CPU mark | 748 vs 556 |
Reasons to consider the AMD Athlon Neo X2 L325
- Around 7% higher clock speed: 1.5 GHz vs 1.4 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 8% better performance in PassMark - Single thread mark: 567 vs 526
| Specifications (specs) | |
| Maximum frequency | 1.5 GHz vs 1.4 GHz |
| L2 cache | 1024 KB vs 512 KB |
| Benchmarks | |
| PassMark - Single thread mark | 567 vs 526 |
Compare benchmarks
CPU 1: Intel Celeron 1047UE
CPU 2: AMD Athlon Neo X2 L325
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron 1047UE | AMD Athlon Neo X2 L325 |
|---|---|---|
| PassMark - Single thread mark | 526 | 567 |
| PassMark - CPU mark | 748 | 556 |
Compare specifications (specs)
| Intel Celeron 1047UE | AMD Athlon Neo X2 L325 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ivy Bridge | Congo |
| Launch date | 1 January 2013 | 10 September 2009 |
| Launch price (MSRP) | $134 | |
| Place in performance rating | 2942 | 2889 |
| Processor Number | 1047UE | |
| Series | Intel® Celeron® Processor 1000 Series | 2x AMD Athlon Neo |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | |
| Bus Speed | 5 GT/s DMI | |
| Die size | 118 mm | |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | 1024 KB |
| L3 cache | 2 MB | |
| Manufacturing process technology | 22 nm | 65 nm |
| Maximum case temperature (TCase) | 105 °C | |
| Maximum core temperature | 105 °C | 95 °C |
| Maximum frequency | 1.4 GHz | 1.5 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| Transistor count | 1400 million | |
| Front-side bus (FSB) | 1600 MHz | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3/DDR3L 1333/1600 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 900 MHz | |
| Graphics max frequency | 900 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | BGA1023 31mm x 24mm | |
| Sockets supported | FCBGA1023 | ASB1 |
| Thermal Design Power (TDP) | 17 Watt | 18 Watt |
Peripherals |
||
| Max number of PCIe lanes | 1 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 & 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| VirusProtect | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||