Intel Celeron 1047UE vs AMD Mobile Sempron SI-40
Comparative analysis of Intel Celeron 1047UE and AMD Mobile Sempron SI-40 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron 1047UE
- CPU is newer: launch date 4 year(s) 5 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 5% higher maximum core temperature: 105 °C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 47% lower typical power consumption: 17 Watt vs 25 Watt
- 2.6x better performance in PassMark - CPU mark: 748 vs 288
Specifications (specs) | |
Launch date | 1 January 2013 vs 4 July 2008 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum core temperature | 105 °C vs 100 °C |
Manufacturing process technology | 22 nm vs 65 nm |
Thermal Design Power (TDP) | 17 Watt vs 25 Watt |
Benchmarks | |
PassMark - CPU mark | 748 vs 288 |
Reasons to consider the AMD Mobile Sempron SI-40
- Around 43% higher clock speed: 2 GHz vs 1.4 GHz
- Around 20% better performance in PassMark - Single thread mark: 631 vs 526
Specifications (specs) | |
Maximum frequency | 2 GHz vs 1.4 GHz |
Benchmarks | |
PassMark - Single thread mark | 631 vs 526 |
Compare benchmarks
CPU 1: Intel Celeron 1047UE
CPU 2: AMD Mobile Sempron SI-40
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 1047UE | AMD Mobile Sempron SI-40 |
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PassMark - Single thread mark | 526 | 631 |
PassMark - CPU mark | 748 | 288 |
Compare specifications (specs)
Intel Celeron 1047UE | AMD Mobile Sempron SI-40 | |
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Essentials |
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Architecture codename | Ivy Bridge | Sable |
Launch date | 1 January 2013 | 4 July 2008 |
Launch price (MSRP) | $134 | |
Place in performance rating | 2931 | 2804 |
Processor Number | 1047UE | |
Series | Intel® Celeron® Processor 1000 Series | AMD Mobile Sempron |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 1.40 GHz | |
Bus Speed | 5 GT/s DMI | |
Die size | 118 mm | |
L1 cache | 128 KB | |
L2 cache | 512 KB | 512 KB |
L3 cache | 2 MB | |
Manufacturing process technology | 22 nm | 65 nm |
Maximum case temperature (TCase) | 105 °C | |
Maximum core temperature | 105 °C | 100 °C |
Maximum frequency | 1.4 GHz | 2 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 1400 million | |
Front-side bus (FSB) | 1800 MHz | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3/DDR3L 1333/1600 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 900 MHz | |
Graphics max frequency | 900 MHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | BGA1023 31mm x 24mm | |
Sockets supported | FCBGA1023 | S1g2 |
Thermal Design Power (TDP) | 17 Watt | 25 Watt |
Peripherals |
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Max number of PCIe lanes | 1 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 & 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |