Intel Celeron 1047UE vs AMD Turion II Neo K625

Comparative analysis of Intel Celeron 1047UE and AMD Turion II Neo K625 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 1047UE

AMD Turion II Neo K625

Differences

Reasons to consider the Intel Celeron 1047UE

CPU is newer: launch date 2 year(s) 7 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 21% better performance in PassMark - CPU mark: 748 vs 618

Specifications (specs)
Launch date	1 January 2013 vs 12 May 2010
Manufacturing process technology	22 nm vs 45 nm
Benchmarks
PassMark - CPU mark	748 vs 618

Reasons to consider the AMD Turion II Neo K625

Around 7% higher clock speed: 1.5 GHz vs 1.4 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 13% lower typical power consumption: 15 Watt vs 17 Watt
Around 20% better performance in PassMark - Single thread mark: 631 vs 526

Specifications (specs)
Maximum frequency	1.5 GHz vs 1.4 GHz
L2 cache	1024 KB vs 512 KB
Thermal Design Power (TDP)	15 Watt vs 17 Watt
Benchmarks
PassMark - Single thread mark	631 vs 526

Compare benchmarks

CPU 1: Intel Celeron 1047UE
CPU 2: AMD Turion II Neo K625

PassMark - Single thread mark

CPU 1

CPU 2

526

631

PassMark - CPU mark

CPU 1

CPU 2

748

618

Name	Intel Celeron 1047UE	AMD Turion II Neo K625
PassMark - Single thread mark	526	631
PassMark - CPU mark	748	618

Compare specifications (specs)

	Intel Celeron 1047UE	AMD Turion II Neo K625
Essentials
Architecture codename	Ivy Bridge	Geneva
Launch date	1 January 2013	12 May 2010
Launch price (MSRP)	$134
Place in performance rating	2931	2791
Processor Number	1047UE
Series	Intel® Celeron® Processor 1000 Series	AMD Turion II Neo
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.40 GHz
Bus Speed	5 GT/s DMI
Die size	118 mm
L1 cache	128 KB
L2 cache	512 KB	1024 KB
L3 cache	2 MB
Manufacturing process technology	22 nm	45 nm
Maximum case temperature (TCase)	105 °C
Maximum core temperature	105 °C
Maximum frequency	1.4 GHz	1.5 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1400 million
Front-side bus (FSB)		3200 MHz
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3/DDR3L 1333/1600
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	900 MHz
Graphics max frequency	900 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	BGA1023 31mm x 24mm
Sockets supported	FCBGA1023	S1
Thermal Design Power (TDP)	17 Watt	15 Watt
Peripherals
Max number of PCIe lanes	1
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 & 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)