Intel Celeron 2961Y vs Intel Core Duo T2700

Comparative analysis of Intel Celeron 2961Y and Intel Core Duo T2700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 2961Y

Intel Core Duo T2700

Differences

Reasons to consider the Intel Celeron 2961Y

CPU is newer: launch date 7 year(s) 4 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
2.6x lower typical power consumption: 11.5 Watt vs 31 Watt
Around 37% better performance in PassMark - CPU mark: 684 vs 498

Specifications (specs)
Launch date	1 December 2013 vs 28 July 2006
Manufacturing process technology	22 nm vs 65 nm
Thermal Design Power (TDP)	11.5 Watt vs 31 Watt
Benchmarks
PassMark - CPU mark	684 vs 498

Reasons to consider the Intel Core Duo T2700

Around 112% higher clock speed: 2.33 GHz vs 1.1 GHz
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 3% better performance in PassMark - Single thread mark: 652 vs 634

Specifications (specs)
Maximum frequency	2.33 GHz vs 1.1 GHz
L2 cache	2048 KB vs 512 KB
Benchmarks
PassMark - Single thread mark	652 vs 634

Compare benchmarks

CPU 1: Intel Celeron 2961Y
CPU 2: Intel Core Duo T2700

PassMark - Single thread mark

CPU 1

CPU 2

634

652

PassMark - CPU mark

CPU 1

CPU 2

684

498

Name	Intel Celeron 2961Y	Intel Core Duo T2700
PassMark - Single thread mark	634	652
PassMark - CPU mark	684	498

Compare specifications (specs)

	Intel Celeron 2961Y	Intel Core Duo T2700
Essentials
Architecture codename	Haswell	Yonah
Launch date	1 December 2013	28 July 2006
Launch price (MSRP)	$107	$663
Place in performance rating	2774	2768
Processor Number	2961Y	T2700
Series	Intel® Celeron® Processor 2000 Series	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.10 GHz	2.33 GHz
Bus Speed	5 GT/s DMI2	667 MHz FSB
Die size	118 mm	90 mm2
L1 cache	128 KB
L2 cache	512 KB	2048 KB
L3 cache	2 MB
Manufacturing process technology	22 nm	65 nm
Maximum case temperature (TCase)	105 °C
Maximum core temperature	100°C	100°C
Maximum frequency	1.1 GHz	2.33 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1400 million	151 million
Front-side bus (FSB)		667 MHz
VID voltage range		1.1625V - 1.30V
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3L 1333/1600, LPDDR3 1333/1600	DDR1
Graphics
Graphics base frequency	200 MHz
Graphics max dynamic frequency	850 MHz
Graphics max frequency	850 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
eDP
HDMI
Number of displays supported	3
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	40mm x 24mm x 1.5mm	35mm x 35mm
Scenario Design Power (SDP)	6 W	0 W
Sockets supported	BGA	PPGA478, PBGA479
Thermal Design Power (TDP)	11.5 Watt	31 Watt
Peripherals
Integrated IDE
Integrated LAN
Max number of PCIe lanes	12
Max number of SATA 6 Gb/s Ports	4
Number of USB ports	4
PCI Express revision	2.0
PCI support
PCIe configurations	4x1, 2x4
Total number of SATA ports	4
UART
USB revision	3.0
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
General-Purpose Input/Output (GPIO)
HD Audio
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Active Management technology (AMT)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® ME Firmware Version	9.5
Intel® Rapid Storage technology (RST)
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Matrix Storage
Smart Connect
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Physical Address Extensions (PAE)		32-bit
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)