Intel Celeron 877 vs Intel Core 2 Duo T7100
Comparative analysis of Intel Celeron 877 and Intel Core 2 Duo T7100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 877
- CPU is newer: launch date 4 year(s) 6 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
- Around 14% better performance in PassMark - CPU mark: 693 vs 607
- Around 5% better performance in Geekbench 4 - Single Core: 252 vs 241
- Around 16% better performance in Geekbench 4 - Multi-Core: 450 vs 388
| Specifications (specs) | |
| Launch date | 1 December 2011 vs 9 May 2007 |
| Manufacturing process technology | 32 nm vs 65 nm |
| L1 cache | 128 KB vs 64 KB |
| Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - CPU mark | 693 vs 607 |
| Geekbench 4 - Single Core | 252 vs 241 |
| Geekbench 4 - Multi-Core | 450 vs 388 |
Reasons to consider the Intel Core 2 Duo T7100
- Around 29% higher clock speed: 1.8 GHz vs 1.4 GHz
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 7% better performance in PassMark - Single thread mark: 690 vs 646
| Specifications (specs) | |
| Maximum frequency | 1.8 GHz vs 1.4 GHz |
| L2 cache | 2048 KB vs 512 KB |
| Benchmarks | |
| PassMark - Single thread mark | 690 vs 646 |
Compare benchmarks
CPU 1: Intel Celeron 877
CPU 2: Intel Core 2 Duo T7100
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Celeron 877 | Intel Core 2 Duo T7100 |
|---|---|---|
| PassMark - Single thread mark | 646 | 690 |
| PassMark - CPU mark | 693 | 607 |
| Geekbench 4 - Single Core | 252 | 241 |
| Geekbench 4 - Multi-Core | 450 | 388 |
Compare specifications (specs)
| Intel Celeron 877 | Intel Core 2 Duo T7100 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Merom |
| Launch date | 1 December 2011 | 9 May 2007 |
| Place in performance rating | 3044 | 3040 |
| Processor Number | 877 | T7100 |
| Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $197 | |
| Price now | $21.99 | |
| Value for money (0-100) | 13.62 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | 1.80 GHz |
| Bus Speed | 5 GT/s DMI | 800 MHz FSB |
| Die size | 131 mm | 143 mm2 |
| L1 cache | 128 KB | 64 KB |
| L2 cache | 512 KB | 2048 KB |
| L3 cache | 2048 KB | |
| Manufacturing process technology | 32 nm | 65 nm |
| Maximum core temperature | 100 °C | 100°C |
| Maximum frequency | 1.4 GHz | 1.8 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| Transistor count | 504 million | 291 million |
| Front-side bus (FSB) | 800 MHz | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm x 35mm |
| Sockets supported | BGA1023 | PPGA478, PBGA479 |
| Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
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