Intel Celeron 877 vs Intel Pentium M 1.50

Comparative analysis of Intel Celeron 877 and Intel Pentium M 1.50 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 877

  • CPU is newer: launch date 8 year(s) 9 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 130 nm
  • 8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 47% lower typical power consumption: 17 Watt vs 24.5 Watt
  • Around 40% better performance in PassMark - Single thread mark: 646 vs 460
  • Around 89% better performance in PassMark - CPU mark: 693 vs 366
Specifications (specs)
Launch date 1 December 2011 vs March 2003
Number of cores 2 vs 1
Manufacturing process technology 32 nm vs 130 nm
L1 cache 128 KB vs 16 KB
Thermal Design Power (TDP) 17 Watt vs 24.5 Watt
Benchmarks
PassMark - Single thread mark 646 vs 460
PassMark - CPU mark 693 vs 366

Reasons to consider the Intel Pentium M 1.50

  • Around 7% higher clock speed: 1.5 GHz vs 1.4 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 1.5 GHz vs 1.4 GHz
L2 cache 1024 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Celeron 877
CPU 2: Intel Pentium M 1.50

PassMark - Single thread mark
CPU 1
CPU 2
646
460
PassMark - CPU mark
CPU 1
CPU 2
693
366
Name Intel Celeron 877 Intel Pentium M 1.50
PassMark - Single thread mark 646 460
PassMark - CPU mark 693 366
Geekbench 4 - Single Core 252
Geekbench 4 - Multi-Core 450

Compare specifications (specs)

Intel Celeron 877 Intel Pentium M 1.50

Essentials

Architecture codename Sandy Bridge Banias
Launch date 1 December 2011 March 2003
Place in performance rating 3046 3054
Processor Number 877
Series Legacy Intel® Celeron® Processor Legacy Intel® Pentium® Processor
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.40 GHz 1.50 GHz
Bus Speed 5 GT/s DMI 400 MHz FSB
Die size 131 mm 83 mm2
L1 cache 128 KB 16 KB
L2 cache 512 KB 1024 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm 130 nm
Maximum core temperature 100 °C 100°C
Maximum frequency 1.4 GHz 1.5 GHz
Number of cores 2 1
Number of threads 2
Transistor count 504 million 77 million
VID voltage range 0.956-1.484V

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333 DDR1, DDR2

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 31.0mm x 24.0mm (BGA1023) 35mm x 35mm
Sockets supported BGA1023 PPGA478, H-PBGA479
Thermal Design Power (TDP) 17 Watt 24.5 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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