Intel Celeron 947UE vs Intel Core i3-3210

Comparative analysis of Intel Celeron 947UE and Intel Core i3-3210 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Celeron 947UE

Intel Core i3-3210

Differences

Reasons to consider the Intel Celeron 947UE

3.2x lower typical power consumption: 17 Watt vs 55 Watt

Thermal Design Power (TDP)	17 Watt vs 55 Watt

Reasons to consider the Intel Core i3-3210

1 more cores, run more applications at once: 2 vs 1
Around 129% higher clock speed: 3.2 GHz vs 1.4 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
3x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	2 vs 1
Maximum frequency	3.2 GHz vs 1.4 GHz
L1 cache	64 KB (per core) vs 64 KB (per core)
L2 cache	256 KB (per core) vs 256 KB (per core)
L3 cache	3072 KB (shared) vs 1024 KB

Compare benchmarks

CPU 1: Intel Celeron 947UE
CPU 2: Intel Core i3-3210

Name	Intel Celeron 947UE	Intel Core i3-3210
PassMark - Single thread mark		1704
PassMark - CPU mark		2233
Geekbench 4 - Single Core		543
Geekbench 4 - Multi-Core		1244
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		6.351

Compare specifications (specs)

	Intel Celeron 947UE	Intel Core i3-3210
Essentials
Architecture codename	Ivy Bridge	Ivy Bridge
Launch date	January 2013	January 2013
Place in performance rating	not rated	2221
Vertical segment	Laptop	Desktop
Launch price (MSRP)		$120
Price now		$138
Processor Number		i3-3210
Series		Legacy Intel® Core™ Processors
Status		Discontinued
Value for money (0-100)		8.60
Performance
64 bit support
Die size	118 mm	94 mm
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	256 KB (per core)	256 KB (per core)
L3 cache	1024 KB	3072 KB (shared)
Manufacturing process technology	22 nm	22 nm
Maximum case temperature (TCase)	105 °C	65 °C
Maximum frequency	1.4 GHz	3.2 GHz
Number of cores	1	2
Transistor count	1400 million
Base frequency		3.20 GHz
Bus Speed		5 GT/s DMI
Maximum core temperature		65.3°C
Number of threads		4
Memory
Supported memory types	DDR3	DDR3 1333/1600
Max memory channels		2
Maximum memory bandwidth		25.6 GB/s
Maximum memory size		32 GB
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	Intel BGA1023	FCLGA1155
Thermal Design Power (TDP)	17 Watt	55 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Thermal Solution		2011C
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Device ID		0x152
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.05 GHz
Graphics max frequency		1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel® HD Graphics 2500
Graphics interfaces
Number of displays supported		3
Wireless Display (WiDi) support
Peripherals
PCI Express revision		2.0
PCIe configurations		up to 1x16, 2x8, 1x8 & 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring