Intel Celeron 947UE vs Intel Core i3-3210

Comparative analysis of Intel Celeron 947UE and Intel Core i3-3210 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Graphics, Graphics interfaces, Peripherals, Security & Reliability, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

 

Differences

Reasons to consider the Intel Celeron 947UE

  • 3.2x lower typical power consumption: 17 Watt vs 55 Watt
Thermal Design Power (TDP) 17 Watt vs 55 Watt

Reasons to consider the Intel Core i3-3210

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 129% higher clock speed: 3.2 GHz vs 1.4 GHz
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 3x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores 2 vs 1
Maximum frequency 3.2 GHz vs 1.4 GHz
L1 cache 64 KB (per core) vs 64 KB (per core)
L2 cache 256 KB (per core) vs 256 KB (per core)
L3 cache 3072 KB (shared) vs 1024 KB

Compare benchmarks

CPU 1: Intel Celeron 947UE
CPU 2: Intel Core i3-3210

Name Intel Celeron 947UE Intel Core i3-3210
PassMark - Single thread mark 1705
PassMark - CPU mark 2227
Geekbench 4 - Single Core 543
Geekbench 4 - Multi-Core 1244
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 6.351

Compare specifications (specs)

Intel Celeron 947UE Intel Core i3-3210

Essentials

Architecture codename Ivy Bridge Ivy Bridge
Launch date January 2013 January 2013
Place in performance rating not rated 2217
Vertical segment Laptop Desktop
Launch price (MSRP) $120
Price now $138
Processor Number i3-3210
Series Legacy Intel® Core™ Processors
Status Discontinued
Value for money (0-100) 8.60

Performance

64 bit support
Die size 118 mm 94 mm
L1 cache 64 KB (per core) 64 KB (per core)
L2 cache 256 KB (per core) 256 KB (per core)
L3 cache 1024 KB 3072 KB (shared)
Manufacturing process technology 22 nm 22 nm
Maximum case temperature (TCase) 105 °C 65 °C
Maximum frequency 1.4 GHz 3.2 GHz
Number of cores 1 2
Transistor count 1400 million
Base frequency 3.20 GHz
Bus Speed 5 GT/s DMI
Maximum core temperature 65.3°C
Number of threads 4

Memory

Supported memory types DDR3 DDR3 1333/1600
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported Intel BGA1023 FCLGA1155
Thermal Design Power (TDP) 17 Watt 55 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Thermal Solution 2011C

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics

Device ID 0x152
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.05 GHz
Graphics max frequency 1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2500

Graphics interfaces

Number of displays supported 3
Wireless Display (WiDi) support

Peripherals

PCI Express revision 2.0
PCIe configurations up to 1x16, 2x8, 1x8 & 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

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