Intel Celeron B830 vs Intel Core Duo T2500
Comparative analysis of Intel Celeron B830 and Intel Core Duo T2500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron B830
- CPU is newer: launch date 6 year(s) 8 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 35% better performance in PassMark - Single thread mark: 828 vs 613
- 2.1x better performance in PassMark - CPU mark: 863 vs 408
Specifications (specs) | |
Launch date | 2 September 2012 vs January 2006 |
Manufacturing process technology | 32 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 828 vs 613 |
PassMark - CPU mark | 863 vs 408 |
Reasons to consider the Intel Core Duo T2500
- Around 11% higher clock speed: 2 GHz vs 1.8 GHz
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 13% lower typical power consumption: 31 Watt vs 35 Watt
Maximum frequency | 2 GHz vs 1.8 GHz |
L2 cache | 2048 KB vs 256 KB (per core) |
Thermal Design Power (TDP) | 31 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Celeron B830
CPU 2: Intel Core Duo T2500
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron B830 | Intel Core Duo T2500 |
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PassMark - Single thread mark | 828 | 613 |
PassMark - CPU mark | 863 | 408 |
Geekbench 4 - Single Core | 323 | |
Geekbench 4 - Multi-Core | 595 |
Compare specifications (specs)
Intel Celeron B830 | Intel Core Duo T2500 | |
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Essentials |
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Architecture codename | Sandy Bridge | Yonah |
Launch date | 2 September 2012 | January 2006 |
Launch price (MSRP) | $86 | $120 |
Place in performance rating | 2830 | 2825 |
Processor Number | B830 | T2500 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Price now | $119.99 | |
Value for money (0-100) | 2.13 | |
Performance |
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64 bit support | ||
Base frequency | 1.80 GHz | 2.00 GHz |
Bus Speed | 5 GT/s DMI | 667 MHz FSB |
Die size | 131 mm | 90 mm2 |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | 2048 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 100 °C | 100°C |
Maximum frequency | 1.8 GHz | 2 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 504 million | 151 million |
Front-side bus (FSB) | 667 MHz | |
VID voltage range | 1.1625V - 1.30V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | DDR1 |
Graphics |
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Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mmx37.5mm (rPGA988B) | 35mm x 35mm |
Sockets supported | FCPGA988 | PPGA478, PBGA479 |
Thermal Design Power (TDP) | 35 Watt | 31 Watt |
Scenario Design Power (SDP) | 0 W | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |