Intel Celeron G1630 vs AMD Phenom II X3 700e

Comparative analysis of Intel Celeron G1630 and AMD Phenom II X3 700e processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

Intel Celeron G1630

AMD Phenom II X3 700e

Differences

Reasons to consider the Intel Celeron G1630

CPU is newer: launch date 4 year(s) 3 month(s) later
Around 17% higher clock speed: 2.8 GHz vs 2.4 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 18% lower typical power consumption: 55 Watt vs 65 Watt
Around 62% better performance in PassMark - Single thread mark: 1553 vs 961
Around 18% better performance in PassMark - CPU mark: 1707 vs 1451

Specifications (specs)
Launch date	September 2013 vs June 2009
Maximum frequency	2.8 GHz vs 2.4 GHz
Manufacturing process technology	22 nm vs 45 nm
Thermal Design Power (TDP)	55 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark	1553 vs 961
PassMark - CPU mark	1707 vs 1451

Reasons to consider the AMD Phenom II X3 700e

1 more cores, run more applications at once: 3 vs 2
3x more L1 cache, more data can be stored in the L1 cache for quick access later
3x more L2 cache, more data can be stored in the L2 cache for quick access later
3x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	3 vs 2
L1 cache	128 KB (per core) vs 64 KB (per core)
L2 cache	512 KB (per core) vs 256 KB (per core)
L3 cache	6144 KB (shared) vs 2048 KB (shared)

Compare benchmarks

CPU 1: Intel Celeron G1630
CPU 2: AMD Phenom II X3 700e

PassMark - Single thread mark

CPU 1

CPU 2

1553

961

PassMark - CPU mark

CPU 1

CPU 2

1707

1451

Name	Intel Celeron G1630	AMD Phenom II X3 700e
PassMark - Single thread mark	1553	961
PassMark - CPU mark	1707	1451
Geekbench 4 - Single Core	2548
Geekbench 4 - Multi-Core	4195
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	1.086
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	27.343
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.176
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.791
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	2.363
GFXBench 4.0 - T-Rex (Frames)	770
GFXBench 4.0 - T-Rex (Fps)	770

Compare specifications (specs)

	Intel Celeron G1630	AMD Phenom II X3 700e
Essentials
Architecture codename	Ivy Bridge	Heka
Launch date	September 2013	June 2009
Launch price (MSRP)	$80
Place in performance rating	2216	2221
Price now	$49.99
Processor Number	G1630
Series	Intel® Celeron® Processor G Series
Status	Discontinued
Value for money (0-100)	14.68
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.80 GHz
Bus Speed	5 GT/s DMI
Die size	94 mm	258 mm
L1 cache	64 KB (per core)	128 KB (per core)
L2 cache	256 KB (per core)	512 KB (per core)
L3 cache	2048 KB (shared)	6144 KB (shared)
Manufacturing process technology	22 nm	45 nm
Maximum case temperature (TCase)	65 °C
Maximum frequency	2.8 GHz	2.4 GHz
Number of cores	2	3
Number of threads	2
Transistor count		758 million
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1333	DDR3
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.05 GHz
Graphics max frequency	1.05 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	3
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1155	AM3
Thermal Design Power (TDP)	55 Watt	65 Watt
Thermal Solution	2011C
Peripherals
PCI Express revision	2.0
PCIe configurations	up to 1x16, 2x8, 1x8 & 2x4
Scalability	1S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)