Intel Celeron J3355 vs AMD Sempron X2 2200

Comparative analysis of Intel Celeron J3355 and AMD Sempron X2 2200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron J3355

AMD Sempron X2 2200

Differences

Reasons to consider the Intel Celeron J3355

Around 25% higher clock speed: 2.50 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
6.5x lower typical power consumption: 10 Watt vs 65 Watt
Around 43% better performance in PassMark - Single thread mark: 826 vs 578
Around 20% better performance in PassMark - CPU mark: 1197 vs 995

Specifications (specs)
Maximum frequency	2.50 GHz vs 2 GHz
Manufacturing process technology	14 nm vs 65 nm
Thermal Design Power (TDP)	10 Watt vs 65 Watt
Benchmarks
PassMark - Single thread mark	826 vs 578
PassMark - CPU mark	1197 vs 995

Reasons to consider the AMD Sempron X2 2200

Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: Intel Celeron J3355
CPU 2: AMD Sempron X2 2200

PassMark - Single thread mark

CPU 1

CPU 2

826

578

PassMark - CPU mark

CPU 1

CPU 2

1197

995

Name	Intel Celeron J3355	AMD Sempron X2 2200
PassMark - Single thread mark	826	578
PassMark - CPU mark	1197	995
Geekbench 4 - Single Core	302
Geekbench 4 - Multi-Core	572

Compare specifications (specs)

	Intel Celeron J3355	AMD Sempron X2 2200
Essentials
Architecture codename	Apollo Lake	Brisbane
Launch date	Q3'16	March 2008
Place in performance rating	2852	2862
Processor Number	J3355
Series	Intel® Celeron® Processor J Series
Status	Launched
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.00 GHz
Manufacturing process technology	14 nm	65 nm
Maximum core temperature	105°C
Maximum frequency	2.50 GHz	2 GHz
Number of cores	2	2
Number of threads	2
Die size		118 mm
L1 cache		128 KB
L2 cache		256 KB
Transistor count		221 million
Memory
Max memory channels	2
Maximum memory size	8 GB
Supported memory types	DDR3L/LPDDR3 up to 1866 MT/s; LPDDR4 up to 2400 MT/s
Graphics
Execution Units	12
Graphics base frequency	250 MHz
Graphics max frequency	700 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	8 GB
Processor graphics	Intel® HD Graphics 500
Graphics interfaces
DisplayPort
eDP
HDMI
MIPI-DSI
Number of displays supported	3
Graphics API support
DirectX	Yes
OpenGL	Yes
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	24mm x 31mm
Sockets supported	FCBGA1296	AM2
Thermal Design Power (TDP)	10 Watt	65 Watt
Peripherals
Integrated LAN
Max number of PCIe lanes	6
Max number of SATA 6 Gb/s Ports	2
Number of USB ports	8
PCI Express revision	2.0
PCIe configurations	1x4 + 1x2 or 4x1 or 2x1+1x2 + 1x2
Total number of SATA ports	2
UART
USB revision	2.0/3.0
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
General-Purpose Input/Output (GPIO)
HD Audio
Idle States
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Rapid Storage technology (RST)
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Smart Connect
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Itanium (VT-i)
Intel® VT-x with Extended Page Tables (EPT)