Intel Celeron M 723 vs Intel Core Duo T2300

Comparative analysis of Intel Celeron M 723 and Intel Core Duo T2300 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron M 723

Intel Core Duo T2300

Differences

Reasons to consider the Intel Celeron M 723

CPU is newer: launch date 2 year(s) 8 month(s) later
Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
3.1x lower typical power consumption: 10 Watt vs 31 Watt

Launch date	1 September 2008 vs January 2006
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	45 nm vs 65 nm
Thermal Design Power (TDP)	10 Watt vs 31 Watt

Reasons to consider the Intel Core Duo T2300

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 38% higher clock speed: 1.66 GHz vs 1.2 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 22% better performance in PassMark - CPU mark: 325 vs 267

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	1.66 GHz vs 1.2 GHz
L2 cache	2048 KB vs 1024 KB
Benchmarks
PassMark - Single thread mark	509 vs 507
PassMark - CPU mark	325 vs 267

Compare benchmarks

CPU 1: Intel Celeron M 723
CPU 2: Intel Core Duo T2300

PassMark - Single thread mark

CPU 1

CPU 2

507

509

PassMark - CPU mark

CPU 1

CPU 2

267

325

Name	Intel Celeron M 723	Intel Core Duo T2300
PassMark - Single thread mark	507	509
PassMark - CPU mark	267	325

Compare specifications (specs)

	Intel Celeron M 723	Intel Core Duo T2300
Essentials
Architecture codename	Penryn	Yonah
Launch date	1 September 2008	January 2006
Place in performance rating	2986	2993
Processor Number	723	T2300
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.20 GHz	1.66 GHz
Bus Speed	800 MHz FSB	667 MHz FSB
Die size	107 mm2	90 mm2
Front-side bus (FSB)	800 MHz	667 MHz
L2 cache	1024 KB	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	105°C	100°C
Maximum frequency	1.2 GHz	1.66 GHz
Number of cores	1	2
Number of threads	1	2
Transistor count	410 million	151 million
VID voltage range	1.050V-1.150V	1.1625V - 1.30V
Compatibility
Low Halogen Options Available
Package Size	22mm x 22mm	35mm x 35mm
Sockets supported	BGA956	PPGA478, PBGA479
Thermal Design Power (TDP)	10 Watt	31 Watt
Max number of CPUs in a configuration		1
Scenario Design Power (SDP)		0 W
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Idle States
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1