Intel Celeron N4505 vs Intel Celeron G3900E
Comparative analysis of Intel Celeron N4505 and Intel Celeron G3900E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron N4505
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- 3.5x lower typical power consumption: 10 Watt vs 35 Watt
- Around 1% better performance in PassMark - Single thread mark: 1509 vs 1499
- Around 11% better performance in PassMark - CPU mark: 2266 vs 2034
Specifications (specs) | |
Maximum core temperature | 105°C vs 100°C |
Manufacturing process technology | 10 nm vs 14 nm |
Thermal Design Power (TDP) | 10 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 1509 vs 1499 |
PassMark - CPU mark | 2266 vs 2034 |
Reasons to consider the Intel Celeron G3900E
- 4x more maximum memory size: 64 GB vs 16 GB
Maximum memory size | 64 GB vs 16 GB |
Compare benchmarks
CPU 1: Intel Celeron N4505
CPU 2: Intel Celeron G3900E
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron N4505 | Intel Celeron G3900E |
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PassMark - Single thread mark | 1509 | 1499 |
PassMark - CPU mark | 2266 | 2034 |
Compare specifications (specs)
Intel Celeron N4505 | Intel Celeron G3900E | |
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Essentials |
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Architecture codename | Jasper Lake | Skylake |
Launch date | Q1'21 | Q1'16 |
Place in performance rating | 1705 | 1723 |
Processor Number | N4505 | G3900E |
Series | Intel Celeron Processor N Series | Intel® Celeron® Processor G Series |
Vertical segment | Mobile | Embedded |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 2.00 GHz | 2.40 GHz |
L3 cache | 4 MB | |
Manufacturing process technology | 10 nm | 14 nm |
Maximum core temperature | 105°C | 100°C |
Maximum frequency | 2.90 GHz | |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Bus Speed | 8 GT/s DMI3 | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory size | 16 GB | 64 GB |
Supported memory frequency | 2933 MHz | |
Supported memory types | DDR4 LPDDR4x | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
Maximum memory bandwidth | 34.1 GB/s | |
Graphics |
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Device ID | 0x4E55 | 0x1902 |
Execution Units | 16 | |
Graphics base frequency | 450 MHz | 350 MHz |
Graphics max frequency | 750 MHz | |
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics | Intel® HD Graphics 510 |
Graphics max dynamic frequency | 950 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Max video memory | 64 GB | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
MIPI-DSI | ||
Number of displays supported | 3 | 3 |
DVI | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2160@60Hz | 4096x2304@60Hz |
Max resolution over eDP | 4096x2160@60Hz | 4096x2304@60Hz |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | 12 |
OpenGL | 4.5 | 4.4 |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 24mm | 42mm x 28mm |
Sockets supported | FCBGA1338 | FCBGA1440 |
Thermal Design Power (TDP) | 10 Watt | 35 Watt |
Low Halogen Options Available | ||
Peripherals |
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Integrated LAN | ||
Integrated Wireless | Intel Wireless-AX MAC | |
Max number of PCIe lanes | 8 | 16 |
Max number of SATA 6 Gb/s Ports | 2 | |
Number of USB ports | 14 | |
UART | ||
USB revision | 2.0/3.2 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
General-Purpose Input/Output (GPIO) | ||
Idle States | ||
Instruction set extensions | Intel SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Smart Response technology | ||
Intel® Turbo Boost technology | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |