Intel Celeron N5100 vs Intel Celeron G3900TE
Comparative analysis of Intel Celeron N5100 and Intel Celeron G3900TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron N5100
- 2 more cores, run more applications at once: 4 vs 2
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- 5.8x lower typical power consumption: 6 Watt vs 35 Watt
- Around 78% better performance in PassMark - CPU mark: 3284 vs 1850
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 10 nm vs 14 nm |
| Thermal Design Power (TDP) | 6 Watt vs 35 Watt |
| Benchmarks | |
| PassMark - CPU mark | 3284 vs 1850 |
Reasons to consider the Intel Celeron G3900TE
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 2% better performance in PassMark - Single thread mark: 1402 vs 1371
| Specifications (specs) | |
| Maximum memory size | 64 GB vs 16 GB |
| Benchmarks | |
| PassMark - Single thread mark | 1402 vs 1371 |
Compare benchmarks
CPU 1: Intel Celeron N5100
CPU 2: Intel Celeron G3900TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Celeron N5100 | Intel Celeron G3900TE |
|---|---|---|
| PassMark - Single thread mark | 1371 | 1402 |
| PassMark - CPU mark | 3284 | 1850 |
Compare specifications (specs)
| Intel Celeron N5100 | Intel Celeron G3900TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Jasper Lake | Skylake |
| Launch date | Q1'21 | Q4'15 |
| Place in performance rating | 1818 | 1820 |
| Processor Number | N5100 | G3900TE |
| Series | Intel Celeron Processor N Series | Intel® Celeron® Processor G Series |
| Status | Launched | Launched |
| Vertical segment | Mobile | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.10 GHz | 2.30 GHz |
| L3 cache | 4 MB | |
| Manufacturing process technology | 10 nm | 14 nm |
| Maximum core temperature | 105°C | |
| Maximum frequency | 2.80 GHz | |
| Number of cores | 4 | 2 |
| Number of threads | 4 | 2 |
| Bus Speed | 8 GT/s DMI3 | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory size | 16 GB | 64 GB |
| Supported memory frequency | 2933 MHz | |
| Supported memory types | DDR4 LPDDR4x | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
| Maximum memory bandwidth | 34.1 GB/s | |
Graphics |
||
| Device ID | 0x4E61 | 0x1902 |
| Execution Units | 24 | |
| Graphics base frequency | 350.00 GHz | 350 MHz |
| Graphics max frequency | 800 MHz | |
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics | Intel® HD Graphics 510 |
| Graphics max dynamic frequency | 950 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Max video memory | 64 GB | |
Graphics interfaces |
||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| MIPI-DSI | ||
| Number of displays supported | 3 | 3 |
| DVI | ||
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2160@60Hz | 4096x2304@60Hz |
| Max resolution over eDP | 4096x2160@60Hz | 4096x2304@60Hz |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
||
| DirectX | 12 | 12 |
| OpenGL | 4.5 | 4.4 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 35mm x 24mm | 37.5mm x 37.5mm |
| Scenario Design Power (SDP) | 4.8 W | |
| Sockets supported | FCBGA1338 | FCLGA1151 |
| Thermal Design Power (TDP) | 6 Watt | 35 Watt |
| Low Halogen Options Available | ||
| Thermal Solution | PCG 2015A (35W) | |
Peripherals |
||
| Integrated LAN | ||
| Integrated Wireless | Intel Wireless-AX MAC | |
| Max number of PCIe lanes | 8 | 16 |
| Max number of SATA 6 Gb/s Ports | 2 | |
| Number of USB ports | 14 | |
| UART | ||
| USB revision | 2.0/3.2 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||
| Secure Boot | ||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| General-Purpose Input/Output (GPIO) | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Smart Response technology | ||
| Intel® Turbo Boost technology | ||
| Speed Shift technology | ||
| Thermal Monitoring | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
