Intel Core 2 Duo E6600 vs Intel Pentium 4 2.60
Comparative analysis of Intel Core 2 Duo E6600 and Intel Pentium 4 2.60 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6600
- 1 more cores, run more applications at once: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
- Around 49% better performance in PassMark - Single thread mark: 948 vs 637
- 3.3x better performance in PassMark - CPU mark: 939 vs 288
Specifications (specs) | |
Number of cores | 2 vs 1 |
Manufacturing process technology | 65 nm vs 130 nm |
Benchmarks | |
PassMark - Single thread mark | 948 vs 637 |
PassMark - CPU mark | 939 vs 288 |
Reasons to consider the Intel Pentium 4 2.60
- Around 16% higher maximum core temperature: 70°C vs 60.1°C
- Around 3% lower typical power consumption: 62.6 Watt vs 65 Watt
Maximum core temperature | 70°C vs 60.1°C |
Thermal Design Power (TDP) | 62.6 Watt vs 65 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6600
CPU 2: Intel Pentium 4 2.60
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo E6600 | Intel Pentium 4 2.60 |
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PassMark - Single thread mark | 948 | 637 |
PassMark - CPU mark | 939 | 288 |
Geekbench 4 - Single Core | 310 | |
Geekbench 4 - Multi-Core | 533 |
Compare specifications (specs)
Intel Core 2 Duo E6600 | Intel Pentium 4 2.60 | |
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Essentials |
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Architecture codename | Conroe | Northwood |
Launch date | Q3'06 | August 2002 |
Place in performance rating | 2675 | 2711 |
Processor Number | E6600 | |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.40 GHz | 2.60 GHz |
Bus Speed | 1066 MHz FSB | 400 MHz FSB |
Die size | 143 mm2 | 131 mm2 |
Manufacturing process technology | 65 nm | 130 nm |
Maximum core temperature | 60.1°C | 70°C |
Number of cores | 2 | 1 |
Transistor count | 291 million | 55 million |
VID voltage range | 0.8500V-1.5V | 1.345V-1.525V |
L1 cache | 8 KB | |
L2 cache | 512 KB | |
Maximum frequency | 2.6 GHz | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | PPGA478 |
Thermal Design Power (TDP) | 65 Watt | 62.6 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2 |