Intel Core 2 Duo E6600 vs Intel Pentium 4 2.60

Comparative analysis of Intel Core 2 Duo E6600 and Intel Pentium 4 2.60 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo E6600

  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
  • Around 49% better performance in PassMark - Single thread mark: 948 vs 637
  • 3.3x better performance in PassMark - CPU mark: 939 vs 288
Specifications (specs)
Number of cores 2 vs 1
Manufacturing process technology 65 nm vs 130 nm
Benchmarks
PassMark - Single thread mark 948 vs 637
PassMark - CPU mark 939 vs 288

Reasons to consider the Intel Pentium 4 2.60

  • Around 16% higher maximum core temperature: 70°C vs 60.1°C
  • Around 3% lower typical power consumption: 62.6 Watt vs 65 Watt
Maximum core temperature 70°C vs 60.1°C
Thermal Design Power (TDP) 62.6 Watt vs 65 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo E6600
CPU 2: Intel Pentium 4 2.60

PassMark - Single thread mark
CPU 1
CPU 2
948
637
PassMark - CPU mark
CPU 1
CPU 2
939
288
Name Intel Core 2 Duo E6600 Intel Pentium 4 2.60
PassMark - Single thread mark 948 637
PassMark - CPU mark 939 288
Geekbench 4 - Single Core 310
Geekbench 4 - Multi-Core 533

Compare specifications (specs)

Intel Core 2 Duo E6600 Intel Pentium 4 2.60

Essentials

Architecture codename Conroe Northwood
Launch date Q3'06 August 2002
Place in performance rating 2675 2711
Processor Number E6600
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.40 GHz 2.60 GHz
Bus Speed 1066 MHz FSB 400 MHz FSB
Die size 143 mm2 131 mm2
Manufacturing process technology 65 nm 130 nm
Maximum core temperature 60.1°C 70°C
Number of cores 2 1
Transistor count 291 million 55 million
VID voltage range 0.8500V-1.5V 1.345V-1.525V
L1 cache 8 KB
L2 cache 512 KB
Maximum frequency 2.6 GHz

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm 35mm x 35mm
Scenario Design Power (SDP) 0 W
Sockets supported PLGA775 PPGA478
Thermal Design Power (TDP) 65 Watt 62.6 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)

Memory

Supported memory types DDR1, DDR2