Intel Core 2 Duo L7300 vs Intel Pentium Dual Core T4400

Comparative analysis of Intel Core 2 Duo L7300 and Intel Pentium Dual Core T4400 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7300

Intel Pentium Dual Core T4400

Differences

Reasons to consider the Intel Core 2 Duo L7300

2.1x lower typical power consumption: 17 Watt vs 35 Watt

Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T4400

Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
Around 53% better performance in PassMark - Single thread mark: 841 vs 551
Around 46% better performance in PassMark - CPU mark: 780 vs 536

Specifications (specs)
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	841 vs 551
PassMark - CPU mark	780 vs 536

Compare benchmarks

CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Pentium Dual Core T4400

PassMark - Single thread mark

CPU 1

CPU 2

551

841

PassMark - CPU mark

CPU 1

CPU 2

536

780

Name	Intel Core 2 Duo L7300	Intel Pentium Dual Core T4400
PassMark - Single thread mark	551	841
PassMark - CPU mark	536	780
Geekbench 4 - Single Core		258
Geekbench 4 - Multi-Core		445

Compare specifications (specs)

	Intel Core 2 Duo L7300	Intel Pentium Dual Core T4400
Essentials
Architecture codename	Merom	Penryn
Launch date	Q2'07	1 December 2009
Place in performance rating	2893	2884
Processor Number	L7300	T4400
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.40 GHz	2.20 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	143 mm2	107 mm2
Manufacturing process technology	65 nm	45 nm
Maximum core temperature	100°C	105°C
Number of cores	2	2
Transistor count	291 million	410 million
VID voltage range	0.975V-1.062V
Front-side bus (FSB)		800 MHz
L1 cache		128 KB
L2 cache		1024 KB
Maximum frequency		2.2 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	35mm x 35mm
Sockets supported	PBGA479	PGA478
Thermal Design Power (TDP)	17 Watt	35 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)