Intel Core i3-10100F vs Intel Core i7-4770
Comparative analysis of Intel Core i3-10100F and Intel Core i7-4770 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-10100F
- Around 10% higher clock speed: 4.30 GHz vs 3.90 GHz
- Around 38% higher maximum core temperature: 100°C vs 72.72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 4x more maximum memory size: 128 GB vs 32 GB
- Around 29% lower typical power consumption: 65 Watt vs 84 Watt
- Around 19% better performance in PassMark - Single thread mark: 2586 vs 2170
- Around 23% better performance in PassMark - CPU mark: 8715 vs 7061
- Around 34% better performance in 3DMark Fire Strike - Physics Score: 3176 vs 2366
| Specifications (specs) | |
| Maximum frequency | 4.30 GHz vs 3.90 GHz |
| Maximum core temperature | 100°C vs 72.72°C |
| Manufacturing process technology | 14 nm vs 22 nm |
| Maximum memory size | 128 GB vs 32 GB |
| Thermal Design Power (TDP) | 65 Watt vs 84 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2586 vs 2170 |
| PassMark - CPU mark | 8715 vs 7061 |
| 3DMark Fire Strike - Physics Score | 3176 vs 2366 |
Reasons to consider the Intel Core i7-4770
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
| L3 cache | 8192 KB (shared) vs 6 MB |
Compare benchmarks
CPU 1: Intel Core i3-10100F
CPU 2: Intel Core i7-4770
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | Intel Core i3-10100F | Intel Core i7-4770 |
|---|---|---|
| PassMark - Single thread mark | 2586 | 2170 |
| PassMark - CPU mark | 8715 | 7061 |
| 3DMark Fire Strike - Physics Score | 3176 | 2366 |
| Geekbench 4 - Single Core | 910 | |
| Geekbench 4 - Multi-Core | 3378 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.185 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 85.915 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.636 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.532 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.243 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1224 | |
| GFXBench 4.0 - Manhattan (Frames) | 2382 | |
| GFXBench 4.0 - T-Rex (Frames) | 4024 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1224 | |
| GFXBench 4.0 - Manhattan (Fps) | 2382 | |
| GFXBench 4.0 - T-Rex (Fps) | 4024 |
Compare specifications (specs)
| Intel Core i3-10100F | Intel Core i7-4770 | |
|---|---|---|
Essentials |
||
| Architecture codename | Comet Lake | Haswell |
| Launch date | Q4'20 | June 2013 |
| Launch price (MSRP) | $79 - $97 | $500 |
| Place in performance rating | 1188 | 1593 |
| Processor Number | i3-10100F | i7-4770 |
| Series | 10th Generation Intel Core i3 Processors | 4th Generation Intel® Core™ i7 Processors |
| Status | Launched | Discontinued |
| Vertical segment | Desktop | Desktop |
| Price now | $239.99 | |
| Value for money (0-100) | 12.01 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.60 GHz | 3.40 GHz |
| Bus Speed | 8 GT/s | 5 GT/s DMI2 |
| L1 cache | 256 KB | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| L3 cache | 6 MB | 8192 KB (shared) |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum core temperature | 100°C | 72.72°C |
| Maximum frequency | 4.30 GHz | 3.90 GHz |
| Number of cores | 4 | 4 |
| Number of threads | 8 | 8 |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 72 °C | |
| Transistor count | 1400 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 41.6 GB/s | 25.6 GB/s |
| Maximum memory size | 128 GB | 32 GB |
| Supported memory types | DDR4-2666 | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA1200 | FCLGA1150 |
| Thermal Design Power (TDP) | 65 Watt | 84 Watt |
| Thermal Solution | PCG 2015C | PCG 2013D |
| Low Halogen Options Available | ||
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | Up to 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | Up to 1x16, 2x8, 1x8+2x4 |
| Scalability | 1S Only | 1S Only |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
| Anti-Theft technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Thermal Velocity Boost | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® My WiFi technology | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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| Device ID | 0x412 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.20 GHz | |
| Graphics max frequency | 1.2 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 2 GB | |
| Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| VGA | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| Max resolution over DisplayPort | 3840x2160@60Hz | |
| Max resolution over eDP | 3840x2160@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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| DirectX | 11.2/12 | |
| OpenGL | 4.3 | |
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