Intel Core i3-10100F vs Intel Xeon E3-1230 v2
Comparative analysis of Intel Core i3-10100F and Intel Xeon E3-1230 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-10100F
- Around 16% higher clock speed: 4.30 GHz vs 3.70 GHz
- Around 52% higher maximum core temperature: 100°C vs 65.8°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 3.9x more maximum memory size: 128 GB vs 32.77 GB
- Around 6% lower typical power consumption: 65 Watt vs 69 Watt
- Around 30% better performance in PassMark - Single thread mark: 2586 vs 1984
- Around 41% better performance in PassMark - CPU mark: 8715 vs 6195
- Around 70% better performance in 3DMark Fire Strike - Physics Score: 3176 vs 1873
Specifications (specs) | |
Maximum frequency | 4.30 GHz vs 3.70 GHz |
Maximum core temperature | 100°C vs 65.8°C |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 128 GB vs 32.77 GB |
Thermal Design Power (TDP) | 65 Watt vs 69 Watt |
Benchmarks | |
PassMark - Single thread mark | 2586 vs 1984 |
PassMark - CPU mark | 8715 vs 6195 |
3DMark Fire Strike - Physics Score | 3176 vs 1873 |
Reasons to consider the Intel Xeon E3-1230 v2
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
L3 cache | 8192 KB (shared) vs 6 MB |
Compare benchmarks
CPU 1: Intel Core i3-10100F
CPU 2: Intel Xeon E3-1230 v2
PassMark - Single thread mark |
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PassMark - CPU mark |
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3DMark Fire Strike - Physics Score |
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Name | Intel Core i3-10100F | Intel Xeon E3-1230 v2 |
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PassMark - Single thread mark | 2586 | 1984 |
PassMark - CPU mark | 8715 | 6195 |
3DMark Fire Strike - Physics Score | 3176 | 1873 |
Geekbench 4 - Single Core | 766 | |
Geekbench 4 - Multi-Core | 2984 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.493 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 78.109 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.544 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.162 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.824 |
Compare specifications (specs)
Intel Core i3-10100F | Intel Xeon E3-1230 v2 | |
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Essentials |
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Architecture codename | Comet Lake | Ivy Bridge |
Launch date | Q4'20 | May 2012 |
Launch price (MSRP) | $79 - $97 | $360 |
Place in performance rating | 1188 | 2275 |
Processor Number | i3-10100F | E3-1230V2 |
Series | 10th Generation Intel Core i3 Processors | Intel® Xeon® Processor E3 v2 Family |
Status | Launched | Discontinued |
Vertical segment | Desktop | Server |
Price now | $352.10 | |
Value for money (0-100) | 7.41 | |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 3.30 GHz |
Bus Speed | 8 GT/s | 5 GT/s DMI |
L1 cache | 256 KB | 64 KB (per core) |
L2 cache | 1 MB | 256 KB (per core) |
L3 cache | 6 MB | 8192 KB (shared) |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 100°C | 65.8°C |
Maximum frequency | 4.30 GHz | 3.70 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
Die size | 160 mm | |
Transistor count | 1400 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 41.6 GB/s | 25.6 GB/s |
Maximum memory size | 128 GB | 32.77 GB |
Supported memory types | DDR4-2666 | DDR3 1333/1600 |
ECC memory support | ||
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1200 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 69 Watt |
Thermal Solution | PCG 2015C | |
Low Halogen Options Available | ||
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® TSX-NI | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |