Intel Core i3-2130 vs AMD Sempron 3200+

Comparative analysis of Intel Core i3-2130 and AMD Sempron 3200+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i3-2130

  • CPU is newer: launch date 5 year(s) 4 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • Around 89% higher clock speed: 3.4 GHz vs 1.8 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 3.4x better performance in PassMark - Single thread mark: 1560 vs 456
  • 8.1x better performance in PassMark - CPU mark: 2043 vs 251
  • Around 54% better performance in Geekbench 4 - Multi-Core: 1276 vs 826
Specifications (specs)
Launch date September 2011 vs May 2006
Number of cores 2 vs 1
Maximum frequency 3.4 GHz vs 1.8 GHz
Manufacturing process technology 32 nm vs 90 nm
L2 cache 256 KB (per core) vs 128 KB
Benchmarks
PassMark - Single thread mark 1560 vs 456
PassMark - CPU mark 2043 vs 251
Geekbench 4 - Multi-Core 1276 vs 826

Reasons to consider the AMD Sempron 3200+

  • Around 5% lower typical power consumption: 62 Watt vs 65 Watt
  • Around 51% better performance in Geekbench 4 - Single Core: 875 vs 578
Specifications (specs)
Thermal Design Power (TDP) 62 Watt vs 65 Watt
Benchmarks
Geekbench 4 - Single Core 875 vs 578

Compare benchmarks

CPU 1: Intel Core i3-2130
CPU 2: AMD Sempron 3200+

PassMark - Single thread mark
CPU 1
CPU 2
1560
456
PassMark - CPU mark
CPU 1
CPU 2
2043
251
Geekbench 4 - Single Core
CPU 1
CPU 2
578
875
Geekbench 4 - Multi-Core
CPU 1
CPU 2
1276
826
Name Intel Core i3-2130 AMD Sempron 3200+
PassMark - Single thread mark 1560 456
PassMark - CPU mark 2043 251
Geekbench 4 - Single Core 578 875
Geekbench 4 - Multi-Core 1276 826
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 2.243
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 37.697
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.254
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.041
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 2.425

Compare specifications (specs)

Intel Core i3-2130 AMD Sempron 3200+

Essentials

Architecture codename Sandy Bridge Manila
Launch date September 2011 May 2006
Launch price (MSRP) $123 $13
Place in performance rating 2735 2743
Price now $69.99 $13
Processor Number i3-2130
Series Legacy Intel® Core™ Processors
Status Discontinued
Value for money (0-100) 17.09 9.19
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.40 GHz
Bus Speed 5 GT/s DMI
Die size 131 mm 103 mm
L1 cache 64 KB (per core) 128 KB
L2 cache 256 KB (per core) 128 KB
L3 cache 3072 KB (shared)
Manufacturing process technology 32 nm 90 nm
Maximum case temperature (TCase) 73 °C
Maximum core temperature 69.1°C
Maximum frequency 3.4 GHz 1.8 GHz
Number of cores 2 1
Number of threads 4
Transistor count 504 million 81 million

Memory

Max memory channels 2
Maximum memory bandwidth 21 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1066/1333

Graphics

Device ID 0x102
Graphics base frequency 850 MHz
Graphics max dynamic frequency 1.10 GHz
Graphics max frequency 1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2000

Graphics interfaces

Number of displays supported 2
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM2
Thermal Design Power (TDP) 65 Watt 62 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)