Intel Core i3-2340UE vs Intel Celeron Dual-Core T1500

Comparative analysis of Intel Core i3-2340UE and Intel Celeron Dual-Core T1500 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core i3-2340UE

Intel Celeron Dual-Core T1500

Differences

Reasons to consider the Intel Core i3-2340UE

CPU is newer: launch date 3 year(s) 1 month(s) later
2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2.1x lower typical power consumption: 17 Watt vs 35 Watt
Around 78% better performance in PassMark - CPU mark: 976 vs 548

Specifications (specs)
Launch date	June 2011 vs 1 May 2008
Number of threads	4 vs 2
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	17 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark	976 vs 548

Reasons to consider the Intel Celeron Dual-Core T1500

Around 44% higher clock speed: 1.87 GHz vs 1.3 GHz
Around 7% better performance in PassMark - Single thread mark: 661 vs 620

Specifications (specs)
Maximum frequency	1.87 GHz vs 1.3 GHz
Benchmarks
PassMark - Single thread mark	661 vs 620

Compare benchmarks

CPU 1: Intel Core i3-2340UE
CPU 2: Intel Celeron Dual-Core T1500

PassMark - Single thread mark

CPU 1

CPU 2

620

661

PassMark - CPU mark

CPU 1

CPU 2

976

548

Name	Intel Core i3-2340UE	Intel Celeron Dual-Core T1500
PassMark - Single thread mark	620	661
PassMark - CPU mark	976	548

Compare specifications (specs)

	Intel Core i3-2340UE	Intel Celeron Dual-Core T1500
Essentials
Architecture codename	Sandy Bridge	Merom
Launch date	June 2011	1 May 2008
Place in performance rating	2792	2761
Processor Number	i3-2340UE
Series	Legacy Intel® Core™ Processors	Intel Celeron Dual-Core
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.30 GHz
Die size	149 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)	512 KB
L3 cache	3072 KB (shared)
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100C (BGA)
Maximum frequency	1.3 GHz	1.87 GHz
Number of cores	2	2
Number of threads	4	2
Transistor count	624 million
Front-side bus (FSB)		533 MHz
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Graphics max frequency	800 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	31mm x 24mm (BGA1023)
Sockets supported	FCBGA1023
Thermal Design Power (TDP)	17 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)