Intel Core i3-2340UE vs Intel Mobile Pentium 4 3.06
Comparative analysis of Intel Core i3-2340UE and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-2340UE
- CPU is newer: launch date 8 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 130 nm
- 16x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4.1x lower typical power consumption: 17 Watt vs 70 Watt
- 2.8x better performance in PassMark - CPU mark: 976 vs 347
| Specifications (specs) | |
| Launch date | June 2011 vs June 2003 |
| Number of cores | 2 vs 1 |
| Manufacturing process technology | 32 nm vs 130 nm |
| L1 cache | 64 KB (per core) vs 8 KB |
| Thermal Design Power (TDP) | 17 Watt vs 70 Watt |
| Benchmarks | |
| PassMark - CPU mark | 976 vs 347 |
Reasons to consider the Intel Mobile Pentium 4 3.06
- Around 136% higher clock speed: 3.07 GHz vs 1.3 GHz
- Around 6% better performance in PassMark - Single thread mark: 657 vs 620
| Specifications (specs) | |
| Maximum frequency | 3.07 GHz vs 1.3 GHz |
| Benchmarks | |
| PassMark - Single thread mark | 657 vs 620 |
Compare benchmarks
CPU 1: Intel Core i3-2340UE
CPU 2: Intel Mobile Pentium 4 3.06
| PassMark - Single thread mark |
|
|
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| PassMark - CPU mark |
|
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| Name | Intel Core i3-2340UE | Intel Mobile Pentium 4 3.06 |
|---|---|---|
| PassMark - Single thread mark | 620 | 657 |
| PassMark - CPU mark | 976 | 347 |
Compare specifications (specs)
| Intel Core i3-2340UE | Intel Mobile Pentium 4 3.06 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Northwood |
| Launch date | June 2011 | June 2003 |
| Place in performance rating | 2787 | 2772 |
| Processor Number | i3-2340UE | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.30 GHz | |
| Die size | 149 mm | 131 mm |
| L1 cache | 64 KB (per core) | 8 KB |
| L2 cache | 256 KB (per core) | 512 KB |
| L3 cache | 3072 KB (shared) | |
| Manufacturing process technology | 32 nm | 130 nm |
| Maximum core temperature | 100C (BGA) | |
| Maximum frequency | 1.3 GHz | 3.07 GHz |
| Number of cores | 2 | 1 |
| Number of threads | 4 | |
| Transistor count | 624 million | 55 million |
| Maximum case temperature (TCase) | 74 °C | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16.6 GB | |
| Supported memory types | DDR3 1066/1333 | DDR1, DDR2 |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 800 MHz | |
| Graphics max frequency | 800 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 31mm x 24mm (BGA1023) | |
| Sockets supported | FCBGA1023 | 478 |
| Thermal Design Power (TDP) | 17 Watt | 70 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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