Intel Core i3-3120ME vs Intel Celeron 807
Comparative analysis of Intel Core i3-3120ME and Intel Celeron 807 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-3120ME
- 1 more cores, run more applications at once: 2 vs 1
- 2 more threads: 4 vs 2
- Around 60% higher clock speed: 2.4 GHz vs 1.5 GHz
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 2 vs 1 |
Number of threads | 4 vs 2 |
Maximum frequency | 2.4 GHz vs 1.5 GHz |
Maximum core temperature | 105°C vs 100 °C |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 64 KB |
L2 cache | 256 KB (per core) vs 256 KB |
L3 cache | 3072 KB (shared) vs 1536 KB |
Reasons to consider the Intel Celeron 807
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-3120ME
CPU 2: Intel Celeron 807
Name | Intel Core i3-3120ME | Intel Celeron 807 |
---|---|---|
PassMark - Single thread mark | 608 | |
PassMark - CPU mark | 392 |
Compare specifications (specs)
Intel Core i3-3120ME | Intel Celeron 807 | |
---|---|---|
Essentials |
||
Architecture codename | Ivy Bridge | Sandy Bridge |
Launch date | August 2012 | 31 July 2012 |
Place in performance rating | not rated | 2821 |
Processor Number | i3-3120ME | 807 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $70 | |
Performance |
||
64 bit support | ||
Base frequency | 2.40 GHz | 1.50 GHz |
Bus Speed | 5 GT/s DMI | 5 GT/s DMI |
Die size | 118 mm | 131 mm |
L1 cache | 64 KB (per core) | 64 KB |
L2 cache | 256 KB (per core) | 256 KB |
L3 cache | 3072 KB (shared) | 1536 KB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 105°C | 100 °C |
Maximum frequency | 2.4 GHz | 1.5 GHz |
Number of cores | 2 | 1 |
Number of threads | 4 | 2 |
Transistor count | 504 million | |
Memory |
||
ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 21.3 GB/s |
Maximum memory size | 16 GB | 16 GB |
Supported memory types | DDR3/DDR3L 1333/1600 | DDR3 1066/1333 |
Graphics |
||
Graphics base frequency | 650 MHz | 350 MHz |
Graphics max dynamic frequency | 900 MHz | 950 MHz |
Graphics max frequency | 900 MHz | 950 MHz |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 4000 | Intel HD Graphics |
Graphics interfaces |
||
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) | 31.0mm x 24.0mm (BGA1023) |
Sockets supported | FCPGA988, FCBGA1023 | FCBGA1023 |
Thermal Design Power (TDP) | 35 Watt | 17 Watt |
Peripherals |
||
Max number of PCIe lanes | 1 | 16 |
PCI Express revision | 2 | 2.0 |
PCIe configurations | 1x16 1x8 2x4 | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
||
Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® Virtualization Technology for Itanium (VT-i) | ||
Intel® VT-x with Extended Page Tables (EPT) |