Intel Core i3-3250 vs AMD Athlon II X3 405e
Comparative analysis of Intel Core i3-3250 and AMD Athlon II X3 405e processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-3250
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 89% better performance in PassMark - Single thread mark: 1837 vs 973
- Around 83% better performance in PassMark - CPU mark: 2442 vs 1331
Specifications (specs) | |
Manufacturing process technology | 22 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 1837 vs 973 |
PassMark - CPU mark | 2442 vs 1331 |
Reasons to consider the AMD Athlon II X3 405e
- 1 more cores, run more applications at once: 3 vs 2
- Around 22% lower typical power consumption: 45 Watt vs 55 Watt
Number of cores | 3 vs 2 |
Thermal Design Power (TDP) | 45 Watt vs 55 Watt |
Compare benchmarks
CPU 1: Intel Core i3-3250
CPU 2: AMD Athlon II X3 405e
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-3250 | AMD Athlon II X3 405e |
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PassMark - Single thread mark | 1837 | 973 |
PassMark - CPU mark | 2442 | 1331 |
Geekbench 4 - Single Core | 664 | |
Geekbench 4 - Multi-Core | 1438 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 41.201 | |
GFXBench 4.0 - T-Rex (Frames) | 1444 | |
GFXBench 4.0 - T-Rex (Fps) | 1444 |
Compare specifications (specs)
Intel Core i3-3250 | AMD Athlon II X3 405e | |
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Essentials |
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Architecture codename | Ivy Bridge | Rana |
Launch date | Q2'13 | October 2009 |
Place in performance rating | 2299 | 2313 |
Processor Number | i3-3250 | |
Series | Legacy Intel® Core™ Processors | |
Status | Launched | |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $80 | |
Price now | $79.99 | |
Value for money (0-100) | 7.46 | |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | |
Bus Speed | 5 GT/s DMI | |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 65.3°C | |
Number of cores | 2 | 3 |
Number of threads | 4 | |
Die size | 169 mm | |
L1 cache | 128 KB (per core) | |
L2 cache | 512 KB (per core) | |
Maximum frequency | 2.3 GHz | |
Transistor count | 300 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1333/1600 | DDR3 |
Graphics |
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Device ID | 0x152 | |
Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2500 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM3 |
Thermal Design Power (TDP) | 55 Watt | 45 Watt |
Thermal Solution | 2011C | |
Peripherals |
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PCI Express revision | 2.0 | |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |