Intel Core i3-3250T vs Intel Pentium G6960
Comparative analysis of Intel Core i3-3250T and Intel Pentium G6960 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-3250T
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 95% higher maximum memory size: 32 GB vs 16.38 GB
- 2.1x lower typical power consumption: 35 Watt vs 73 Watt
- Around 32% better performance in PassMark - Single thread mark: 1684 vs 1279
- Around 85% better performance in PassMark - CPU mark: 2650 vs 1433
Specifications (specs) | |
Number of threads | 4 vs 2 |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 32 GB vs 16.38 GB |
Thermal Design Power (TDP) | 35 Watt vs 73 Watt |
Benchmarks | |
PassMark - Single thread mark | 1684 vs 1279 |
PassMark - CPU mark | 2650 vs 1433 |
Reasons to consider the Intel Pentium G6960
- Around 12% higher maximum core temperature: 72.6°C vs 65.0°C
Maximum core temperature | 72.6°C vs 65.0°C |
Compare benchmarks
CPU 1: Intel Core i3-3250T
CPU 2: Intel Pentium G6960
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-3250T | Intel Pentium G6960 |
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PassMark - Single thread mark | 1684 | 1279 |
PassMark - CPU mark | 2650 | 1433 |
Geekbench 4 - Single Core | 1957 | |
Geekbench 4 - Multi-Core | 3379 |
Compare specifications (specs)
Intel Core i3-3250T | Intel Pentium G6960 | |
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Essentials |
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Architecture codename | Ivy Bridge | Clarkdale |
Launch date | Q2'13 | January 2011 |
Place in performance rating | 1536 | 1532 |
Processor Number | i3-3250T | G6960 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Launched | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 2.93 GHz |
Bus Speed | 5 GT/s DMI | 2.5 GT/s DMI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 65.0°C | 72.6°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Die size | 81 mm2 | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 3072 KB (shared) | |
Maximum frequency | 2.93 GHz | |
Transistor count | 382 million | |
VID voltage range | 0.6500V-1.4000V | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 17 GB/s |
Maximum memory size | 32 GB | 16.38 GB |
Supported memory types | DDR3 1333/1600 | DDR3 1066 |
Graphics |
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Device ID | 0x152 | |
Graphics base frequency | 650 MHz | 533 MHz |
Graphics max dynamic frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2500 | Integrated |
Graphics interfaces |
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Number of displays supported | 3 | 2 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1155 | FCLGA1156 |
Thermal Design Power (TDP) | 35 Watt | 73 Watt |
Thermal Solution | 2011A | |
Peripherals |
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PCI Express revision | 2.0 | 2.0 |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 | 1x16, 2x8 |
Max number of PCIe lanes | 16 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Demand Based Switching | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |