Intel Core i3-4112E vs Intel Core i3-4170T
Comparative analysis of Intel Core i3-4112E and Intel Core i3-4170T processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-4112E
- Around 51% higher maximum core temperature: 100°C vs 66.4°C
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Maximum core temperature | 100°C vs 66.4°C |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-4112E
CPU 2: Intel Core i3-4170T
Name | Intel Core i3-4112E | Intel Core i3-4170T |
---|---|---|
PassMark - Single thread mark | 1824 | |
PassMark - CPU mark | 3218 | |
Geekbench 4 - Single Core | 715 | |
Geekbench 4 - Multi-Core | 1523 |
Compare specifications (specs)
Intel Core i3-4112E | Intel Core i3-4170T | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Haswell |
Launch date | Q2'14 | Q1'15 |
Place in performance rating | not rated | 1895 |
Processor Number | i3-4112E | i3-4170T |
Series | 4th Generation Intel® Core™ i3 Processors | 4th Generation Intel® Core™ i3 Processors |
Status | Launched | Discontinued |
Vertical segment | Embedded | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 1.80 GHz | 3.20 GHz |
Bus Speed | 5 GT/s DMI2 | 5 GT/s DMI2 |
Manufacturing process technology | 22 nm | 22 nm |
Maximum core temperature | 100°C | 66.4°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Maximum memory size | 32 GB | 32 GB |
Supported memory types | DDR3L 1333/1600 | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Graphics |
||
Graphics base frequency | 400 MHz | 200 MHz |
Graphics max dynamic frequency | 900 MHz | 1.15 GHz |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 4600 | Intel® HD Graphics 4400 |
Device ID | 0x41E | |
Max video memory | 2 GB | |
Graphics interfaces |
||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
VGA | ||
DVI | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 32mm x 1.6mm | 37.5mm x 37.5mm |
Sockets supported | FCBGA1364 | FCLGA1150 |
Thermal Design Power (TDP) | 25 Watt | 35 Watt |
Thermal Solution | PCG 2013A | |
Peripherals |
||
Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | Up to 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8 2x4 | Up to 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only | 1S Only |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics image quality |
||
Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
||
DirectX | 11.1/12 | |
OpenGL | 4.3 |