Intel Core i3-4160 vs Intel Core i5-2405S
Comparative analysis of Intel Core i3-4160 and Intel Core i5-2405S processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-4160
- CPU is newer: launch date 3 year(s) 2 month(s) later
- Around 9% higher clock speed: 3.6 GHz vs 3.30 GHz
- Around 4% higher maximum core temperature: 72°C vs 69.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 20% lower typical power consumption: 54 Watt vs 65 Watt
- Around 35% better performance in PassMark - Single thread mark: 1997 vs 1478
- Around 9% better performance in PassMark - CPU mark: 3517 vs 3224
- Around 30% better performance in Geekbench 4 - Single Core: 801 vs 615
Specifications (specs) | |
Launch date | July 2014 vs May 2011 |
Maximum frequency | 3.6 GHz vs 3.30 GHz |
Maximum core temperature | 72°C vs 69.1°C |
Manufacturing process technology | 22 nm vs 32 nm |
Thermal Design Power (TDP) | 54 Watt vs 65 Watt |
Benchmarks | |
PassMark - Single thread mark | 1997 vs 1478 |
PassMark - CPU mark | 3517 vs 3224 |
Geekbench 4 - Single Core | 801 vs 615 |
Reasons to consider the Intel Core i5-2405S
- 2 more cores, run more applications at once: 4 vs 2
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 9% better performance in Geekbench 4 - Multi-Core: 1870 vs 1714
Specifications (specs) | |
Number of cores | 4 vs 2 |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 3072 KB (shared) |
Benchmarks | |
Geekbench 4 - Multi-Core | 1870 vs 1714 |
Compare benchmarks
CPU 1: Intel Core i3-4160
CPU 2: Intel Core i5-2405S
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-4160 | Intel Core i5-2405S |
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PassMark - Single thread mark | 1997 | 1478 |
PassMark - CPU mark | 3517 | 3224 |
Geekbench 4 - Single Core | 801 | 615 |
Geekbench 4 - Multi-Core | 1714 | 1870 |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.495 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 40.003 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.319 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.239 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.033 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 809 | |
GFXBench 4.0 - Manhattan (Frames) | 1758 | |
GFXBench 4.0 - T-Rex (Frames) | 2951 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 809 | |
GFXBench 4.0 - Manhattan (Fps) | 1758 | |
GFXBench 4.0 - T-Rex (Fps) | 2951 |
Compare specifications (specs)
Intel Core i3-4160 | Intel Core i5-2405S | |
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Essentials |
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Architecture codename | Haswell | Sandy Bridge |
Launch date | July 2014 | May 2011 |
Launch price (MSRP) | $133 | $472 |
Place in performance rating | 2115 | 2109 |
Price now | $139.99 | $164.40 |
Processor Number | i3-4160 | i5-2405S |
Series | 4th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Value for money (0-100) | 10.64 | 9.07 |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 2.50 GHz |
Bus Speed | 5 GT/s DMI2 | 5 GT/s DMI |
Die size | 177 mm | 216 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 3072 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 22 nm | 32 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 72°C | 69.1°C |
Maximum frequency | 3.6 GHz | 3.30 GHz |
Number of cores | 2 | 4 |
Number of threads | 4 | 4 |
Transistor count | 1400 million | 1160 million |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 21 GB/s |
Maximum memory size | 32 GB | 32 GB |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 1066/1333 |
Graphics |
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Device ID | 0x41E | 0x112 |
Graphics base frequency | 350 MHz | 850 MHz |
Graphics max dynamic frequency | 1.15 GHz | 1.10 GHz |
Graphics max frequency | 1.15 GHz | 1.1 GHz |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4400 | Intel® HD Graphics 3000 |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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DirectX | 11.1/12 | |
OpenGL | 4.3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 | LGA1155, FCLGA1155 |
Thermal Design Power (TDP) | 54 Watt | 65 Watt |
Thermal Solution | PCG 2013C | |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | Up to 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Identity Protection technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |