Intel Core i3-4170T vs Intel Pentium G4560
Comparative analysis of Intel Core i3-4170T and Intel Pentium G4560 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-4170T
- Around 54% lower typical power consumption: 35 Watt vs 54 Watt
Thermal Design Power (TDP) | 35 Watt vs 54 Watt |
Reasons to consider the Intel Pentium G4560
- Around 51% higher maximum core temperature: 100°C vs 66.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 15% better performance in PassMark - Single thread mark: 2097 vs 1824
- Around 10% better performance in PassMark - CPU mark: 3538 vs 3218
- Around 18% better performance in Geekbench 4 - Single Core: 841 vs 715
- Around 22% better performance in Geekbench 4 - Multi-Core: 1863 vs 1523
Specifications (specs) | |
Maximum core temperature | 100°C vs 66.4°C |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 64 GB vs 32 GB |
Benchmarks | |
PassMark - Single thread mark | 2097 vs 1824 |
PassMark - CPU mark | 3538 vs 3218 |
Geekbench 4 - Single Core | 841 vs 715 |
Geekbench 4 - Multi-Core | 1863 vs 1523 |
Compare benchmarks
CPU 1: Intel Core i3-4170T
CPU 2: Intel Pentium G4560
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
||||
Geekbench 4 - Single Core |
|
|
||||
Geekbench 4 - Multi-Core |
|
|
Name | Intel Core i3-4170T | Intel Pentium G4560 |
---|---|---|
PassMark - Single thread mark | 1824 | 2097 |
PassMark - CPU mark | 3218 | 3538 |
Geekbench 4 - Single Core | 715 | 841 |
Geekbench 4 - Multi-Core | 1523 | 1863 |
3DMark Fire Strike - Physics Score | 2149 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.198 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 22.395 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.312 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.204 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.986 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1003 | |
GFXBench 4.0 - Manhattan (Frames) | 2030 | |
GFXBench 4.0 - T-Rex (Frames) | 3809 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1003 | |
GFXBench 4.0 - Manhattan (Fps) | 2030 | |
GFXBench 4.0 - T-Rex (Fps) | 3809 |
Compare specifications (specs)
Intel Core i3-4170T | Intel Pentium G4560 | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Kaby Lake |
Launch date | Q1'15 | January 2017 |
Place in performance rating | 1897 | 1899 |
Processor Number | i3-4170T | G4560 |
Series | 4th Generation Intel® Core™ i3 Processors | Intel® Pentium® Processor G Series |
Status | Discontinued | Launched |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $108 | |
Price now | $99.99 | |
Value for money (0-100) | 14.35 | |
Performance |
||
64 bit support | ||
Base frequency | 3.20 GHz | 3.50 GHz |
Bus Speed | 5 GT/s DMI2 | 8 GT/s DMI3 |
Manufacturing process technology | 22 nm | 14 nm |
Maximum core temperature | 66.4°C | 100°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 4 |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 3072 KB (shared) | |
Maximum case temperature (TCase) | 65 °C | |
Maximum frequency | 3.5 GHz | |
Number of QPI Links | 0 | |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | 64 GB |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR4-2133/2400, DDR3L-1333/1600 @ 1.35V |
Graphics |
||
Device ID | 0x41E | 0x5902 |
Graphics base frequency | 200 MHz | 350 MHz |
Graphics max dynamic frequency | 1.15 GHz | 1.05 GHz |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | 64 GB |
Processor graphics | Intel® HD Graphics 4400 | Intel® HD Graphics 610 |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video technology | ||
Graphics interfaces |
||
DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
VGA | ||
Graphics image quality |
||
Max resolution over DisplayPort | 3840x2160@60Hz | 4096x2304@60Hz |
Max resolution over eDP | 3840x2160@60Hz | 4096x2304@60Hz |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | 4096x2304@24Hz |
Max resolution over VGA | 1920x1200@60Hz | |
4K resolution support | ||
Graphics API support |
||
DirectX | 11.1/12 | 12 |
OpenGL | 4.3 | 4.4 |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 | FCLGA1151 |
Thermal Design Power (TDP) | 35 Watt | 54 Watt |
Thermal Solution | PCG 2013A | PCG 2015C (65W) |
Peripherals |
||
Max number of PCIe lanes | 16 | 16 |
PCI Express revision | Up to 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | Up to 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only | 1S Only |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Secure Boot | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Optane™ Memory Supported | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |