Intel Core i3-6098P vs AMD A6-6420B
Comparative analysis of Intel Core i3-6098P and AMD A6-6420B processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-6098P
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm SOI
- Around 20% lower typical power consumption: 54 Watt vs 65 Watt
- Around 30% better performance in PassMark - Single thread mark: 2113 vs 1629
- 2.6x better performance in PassMark - CPU mark: 4017 vs 1550
Specifications (specs) | |
Number of threads | 4 vs 2 |
Manufacturing process technology | 14 nm vs 32 nm SOI |
Thermal Design Power (TDP) | 54 Watt vs 65 Watt |
Benchmarks | |
PassMark - Single thread mark | 2113 vs 1629 |
PassMark - CPU mark | 4017 vs 1550 |
Reasons to consider the AMD A6-6420B
- Around 6% higher maximum core temperature: 70°C vs 66°C
Maximum core temperature | 70°C vs 66°C |
Compare benchmarks
CPU 1: Intel Core i3-6098P
CPU 2: AMD A6-6420B
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-6098P | AMD A6-6420B |
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PassMark - Single thread mark | 2113 | 1629 |
PassMark - CPU mark | 4017 | 1550 |
Geekbench 4 - Single Core | 886 | |
Geekbench 4 - Multi-Core | 1901 |
Compare specifications (specs)
Intel Core i3-6098P | AMD A6-6420B | |
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Essentials |
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Architecture codename | Skylake | |
Launch date | Q4'15 | |
Place in performance rating | 1635 | 1623 |
Processor Number | i3-6098P | |
Series | 6th Generation Intel® Core™ i3 Processors | AMD Business Class - Dual-Core A6-Series APU for Desktops |
Status | Discontinued | |
Vertical segment | Desktop | Desktop |
Family | AMD A-Series Processors | |
OPN Tray | AD642BOKA23HL | |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 4 GHz |
Bus Speed | 8 GT/s DMI3 | |
Manufacturing process technology | 14 nm | 32 nm SOI |
Maximum core temperature | 66°C | 70°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
L1 cache | 96 KB | |
L2 cache | 1 MB | |
Maximum frequency | 4.2 GHz | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | |
Supported memory frequency | 1866 MHz | |
Graphics |
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Device ID | ox1902 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 510 | AMD Radeon HD 8470D |
Enduro | ||
Graphics max frequency | 800 MHz | |
iGPU core count | 192 | |
Switchable graphics | ||
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | 11 |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1151 | FM2 |
Thermal Design Power (TDP) | 54 Watt | 65 Watt |
Thermal Solution | PCG 2015C (65W) | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
AMD App Acceleration | ||
AMD Elite Experiences | ||
AMD HD3D technology | ||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
PowerGating | ||
PowerNow | ||
RAID | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) | ||
IOMMU 2.0 |