Intel Core i3-6100E vs AMD Phenom II X2 P650
Comparative analysis of Intel Core i3-6100E and AMD Phenom II X2 P650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-6100E
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 71% better performance in PassMark - Single thread mark: 1688 vs 985
- 3.6x better performance in PassMark - CPU mark: 3315 vs 933
- 2x better performance in Geekbench 4 - Single Core: 3121 vs 1527
- 2.2x better performance in Geekbench 4 - Multi-Core: 5917 vs 2644
Specifications (specs) | |
Number of threads | 4 vs 2 |
Manufacturing process technology | 14 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 1688 vs 985 |
PassMark - CPU mark | 3315 vs 933 |
Geekbench 4 - Single Core | 3121 vs 1527 |
Geekbench 4 - Multi-Core | 5917 vs 2644 |
Compare benchmarks
CPU 1: Intel Core i3-6100E
CPU 2: AMD Phenom II X2 P650
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-6100E | AMD Phenom II X2 P650 |
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PassMark - Single thread mark | 1688 | 985 |
PassMark - CPU mark | 3315 | 933 |
Geekbench 4 - Single Core | 3121 | 1527 |
Geekbench 4 - Multi-Core | 5917 | 2644 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.803 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 38.873 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.216 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.019 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.269 |
Compare specifications (specs)
Intel Core i3-6100E | AMD Phenom II X2 P650 | |
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Essentials |
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Architecture codename | Skylake | Champlain |
Launch date | Q4'15 | 19 October 2010 |
Place in performance rating | 1915 | 1914 |
Processor Number | i3-6100E | |
Series | 6th Generation Intel® Core™ i3 Processors | AMD Phenom II Dual-Core Mobile Processors |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Family | AMD Phenom | |
OPN Tray | HMP650SGR23GM | |
Performance |
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64 bit support | ||
Base frequency | 2.70 GHz | 2.6 GHz |
Bus Speed | 8 GT/s DMI3 | |
Manufacturing process technology | 14 nm | 45 nm |
Maximum core temperature | 100°C | 100°C |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Front-side bus (FSB) | 3600 MHz | |
L1 cache | 256 KB | |
L2 cache | 2 MB | |
Maximum frequency | 2.8 GHz | |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 34.1 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 |
Graphics |
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Device ID | 0x191B | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 950 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 530 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 42mm x 28mm | |
Sockets supported | FCBGA1440 | S1 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
VirusProtect | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |