Intel Core i5-1145GRE vs AMD Ryzen 3 3350U
Comparative analysis of Intel Core i5-1145GRE and AMD Ryzen 3 3350U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i5-1145GRE
- 4 more threads: 8 vs 4
- Around 17% higher clock speed: 4.10 GHz vs 3.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm SuperFin vs 12 nm
- 2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 4% better performance in PassMark - Single thread mark: 1988 vs 1908
- Around 41% better performance in PassMark - CPU mark: 8221 vs 5813
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 4.10 GHz vs 3.5 GHz |
Manufacturing process technology | 10 nm SuperFin vs 12 nm |
L2 cache | 5 MB vs 2 MB |
L3 cache | 8 MB vs 4 MB |
Benchmarks | |
PassMark - Single thread mark | 1988 vs 1908 |
PassMark - CPU mark | 8221 vs 5813 |
Reasons to consider the AMD Ryzen 3 3350U
- Around 5% higher maximum core temperature: 105 °C vs 100C
Maximum core temperature | 105 °C vs 100C |
Compare benchmarks
CPU 1: Intel Core i5-1145GRE
CPU 2: AMD Ryzen 3 3350U
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i5-1145GRE | AMD Ryzen 3 3350U |
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PassMark - Single thread mark | 1988 | 1908 |
PassMark - CPU mark | 8221 | 5813 |
Compare specifications (specs)
Intel Core i5-1145GRE | AMD Ryzen 3 3350U | |
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Essentials |
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Architecture codename | Tiger Lake | Zen+ |
Launch date | 2 Sep 2020 | Q1 2019 |
Launch price (MSRP) | $398 | |
Place in performance rating | 1210 | 1309 |
Processor Number | i5-1145GRE | |
Series | 11th Generation Intel Core i5 Processors | |
Vertical segment | Embedded | Mobile |
OPN Tray | YM3300C4T4MFG | |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 2.1 GHz |
Bus Speed | 4 GT/s | |
L1 cache | 384 KB | 384 KB |
L2 cache | 5 MB | 2 MB |
L3 cache | 8 MB | 4 MB |
Manufacturing process technology | 10 nm SuperFin | 12 nm |
Maximum core temperature | 100C | 105 °C |
Maximum frequency | 4.10 GHz | 3.5 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 4 |
Operating Temperature Range | -40°C to 100°C | |
Number of GPU cores | 6 | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-3200, LPDDR4x-4267, In-Band ECC | DDR4-2400 |
Graphics |
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Device ID | 0x9A49 | |
Execution Units | 80 | |
Graphics max dynamic frequency | 1.30 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel Iris Xe Graphics | Radeon Vega 6 Graphics |
Graphics base frequency | 1200 MHz | |
iGPU core count | 6 | |
Graphics interfaces |
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Number of displays supported | 4 | |
DisplayPort | ||
HDMI | ||
Graphics image quality |
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Max resolution over DisplayPort | 7680x4320@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
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DirectX | 12.1 | |
OpenGL | 4.6 | |
Compatibility |
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Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 28 Watt | |
Max number of CPUs in a configuration | 1 | |
Package Size | 45.5mm x 25mm | |
Sockets supported | FCBGA1449 | FP5 |
Thermal Design Power (TDP) | 15 Watt | 15 Watt |
Configurable TDP | 12-35 Watt | |
Security & Reliability |
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Intel® OS Guard | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) | ||
Peripherals |
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PCI Express revision | 3.0 |