Intel Core i5-3339Y vs AMD Opteron 156

Comparative analysis of Intel Core i5-3339Y and AMD Opteron 156 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i5-3339Y

  • CPU is newer: launch date 7 year(s) 8 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 90 nm
  • 8x lower typical power consumption: 13 Watt vs 104 Watt
Launch date 1 January 2013 vs May 2005
Number of cores 2 vs 1
Manufacturing process technology 22 nm vs 90 nm
Thermal Design Power (TDP) 13 Watt vs 104 Watt

Reasons to consider the AMD Opteron 156

  • Around 50% higher clock speed: 3 GHz vs 2.00 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 3 GHz vs 2.00 GHz
L2 cache 1024 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Core i5-3339Y
CPU 2: AMD Opteron 156

Name Intel Core i5-3339Y AMD Opteron 156
PassMark - Single thread mark 905
PassMark - CPU mark 1589
Geekbench 4 - Single Core 241
Geekbench 4 - Multi-Core 499
GFXBench 4.0 - T-Rex (Frames) 1997
GFXBench 4.0 - T-Rex (Fps) 1997

Compare specifications (specs)

Intel Core i5-3339Y AMD Opteron 156

Essentials

Architecture codename Ivy Bridge Venus
Launch date 1 January 2013 May 2005
Launch price (MSRP) $250
Place in performance rating 2445 not rated
Processor Number i5-3339Y
Series Legacy Intel® Core™ Processors
Status Launched
Vertical segment Mobile Server

Performance

64 bit support
Base frequency 1.50 GHz
Bus Speed 5 GT/s DMI
Die size 118 mm
L1 cache 128 KB 128 KB
L2 cache 512 KB 1024 KB
L3 cache 3072 KB
Manufacturing process technology 22 nm 90 nm
Maximum case temperature (TCase) 67 °C
Maximum core temperature 105 °C
Maximum frequency 2.00 GHz 3 GHz
Number of cores 2 1
Number of threads 4
Transistor count 1400 million 106 million

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3/L/-RS 1333/1600

Graphics

Device ID 0x166
Graphics base frequency 350 MHz
Graphics max dynamic frequency 850 MHz
Graphics max frequency 850 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 4000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 3
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 31mm x 24mm
Scenario Design Power (SDP) 7 W
Sockets supported FCBGA1023 939
Thermal Design Power (TDP) 13 Watt 104 Watt

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)