Intel Core i5-4590 vs Intel Core i3-2102
Comparative analysis of Intel Core i5-4590 and Intel Core i3-2102 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i5-4590
- CPU is newer: launch date 2 year(s) 10 month(s) later
- 2 more cores, run more applications at once: 4 vs 2
- Around 19% higher clock speed: 3.70 GHz vs 3.1 GHz
- Around 5% higher maximum core temperature: 72.72°C vs 69.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 49% better performance in PassMark - Single thread mark: 2085 vs 1400
- 2.6x better performance in PassMark - CPU mark: 5369 vs 2029
Specifications (specs) | |
Launch date | May 2014 vs June 2011 |
Number of cores | 4 vs 2 |
Maximum frequency | 3.70 GHz vs 3.1 GHz |
Maximum core temperature | 72.72°C vs 69.1°C |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 3072 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 2085 vs 1400 |
PassMark - CPU mark | 5369 vs 2029 |
Reasons to consider the Intel Core i3-2102
- Around 29% lower typical power consumption: 65 Watt vs 84 Watt
Thermal Design Power (TDP) | 65 Watt vs 84 Watt |
Compare benchmarks
CPU 1: Intel Core i5-4590
CPU 2: Intel Core i3-2102
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | Intel Core i5-4590 | Intel Core i3-2102 |
---|---|---|
PassMark - Single thread mark | 2085 | 1400 |
PassMark - CPU mark | 5369 | 2029 |
Geekbench 4 - Single Core | 876 | |
Geekbench 4 - Multi-Core | 2820 | |
3DMark Fire Strike - Physics Score | 1893 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.798 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 71.742 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.404 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.137 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.131 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1067 | |
GFXBench 4.0 - Manhattan (Frames) | 2023 | |
GFXBench 4.0 - T-Rex (Frames) | 3383 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1067 | |
GFXBench 4.0 - Manhattan (Fps) | 2023 | |
GFXBench 4.0 - T-Rex (Fps) | 3383 |
Compare specifications (specs)
Intel Core i5-4590 | Intel Core i3-2102 | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Sandy Bridge |
Launch date | May 2014 | June 2011 |
Launch price (MSRP) | $300 | |
Place in performance rating | 1823 | 1830 |
Price now | $188.99 | $58 |
Processor Number | i5-4590 | i3-2102 |
Series | 4th Generation Intel® Core™ i5 Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Value for money (0-100) | 11.38 | 18.97 |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 3.30 GHz | 3.10 GHz |
Bus Speed | 5 GT/s DMI2 | 5 GT/s DMI |
Die size | 177 mm | 131 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 6144 KB (shared) | 3072 KB (shared) |
Manufacturing process technology | 22 nm | 32 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 72.72°C | 69.1°C |
Maximum frequency | 3.70 GHz | 3.1 GHz |
Number of cores | 4 | 2 |
Number of threads | 4 | 4 |
Transistor count | 1400 million | 504 million |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 21 GB/s |
Maximum memory size | 32 GB | 32 GB |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 1066/1333 |
Graphics |
||
Device ID | 0x412 | 0x102 |
Graphics base frequency | 350 MHz | 850 MHz |
Graphics max dynamic frequency | 1.15 GHz | 1.10 GHz |
Graphics max frequency | 1.15 GHz | 1.1 GHz |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4600 | Intel® HD Graphics 2000 |
Graphics interfaces |
||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
||
Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
||
DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 | FCLGA1155 |
Thermal Design Power (TDP) | 84 Watt | 65 Watt |
Thermal Solution | PCG 2013D | |
Peripherals |
||
Max number of PCIe lanes | 16 | 16 |
PCI Express revision | Up to 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
||
Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |