Intel Core i5-6500 vs Intel Xeon E5-2470
Comparative analysis of Intel Core i5-6500 and Intel Xeon E5-2470 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i5-6500
- CPU is newer: launch date 3 year(s) 3 month(s) later
- Around 16% higher clock speed: 3.60 GHz vs 3.10 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
- Around 49% better performance in PassMark - Single thread mark: 2100 vs 1410
Specifications (specs) | |
Launch date | 5 August 2015 vs May 2012 |
Maximum frequency | 3.60 GHz vs 3.10 GHz |
Manufacturing process technology | 14 nm vs 32 nm |
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 2100 vs 1410 |
Reasons to consider the Intel Xeon E5-2470
- 4 more cores, run more applications at once: 8 vs 4
- 12 more threads: 16 vs 4
- Around 10% higher maximum core temperature: 78 °C vs 71°C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 6x more maximum memory size: 384 GB vs 64 GB
- 2.6x better performance in PassMark - CPU mark: 14464 vs 5618
Specifications (specs) | |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 4 |
Maximum core temperature | 78 °C vs 71°C |
L1 cache | 64 KB (per core) vs 256 KB |
L2 cache | 256 KB (per core) vs 1 MB |
L3 cache | 20480 KB (shared) vs 6 MB |
Maximum memory size | 384 GB vs 64 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
PassMark - CPU mark | 14464 vs 5618 |
Compare benchmarks
CPU 1: Intel Core i5-6500
CPU 2: Intel Xeon E5-2470
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i5-6500 | Intel Xeon E5-2470 |
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PassMark - Single thread mark | 2100 | 1410 |
PassMark - CPU mark | 5618 | 14464 |
Geekbench 4 - Single Core | 899 | |
Geekbench 4 - Multi-Core | 2938 | |
3DMark Fire Strike - Physics Score | 2112 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.525 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 75.209 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.436 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.188 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.811 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1575 | |
GFXBench 4.0 - Manhattan (Frames) | 3075 | |
GFXBench 4.0 - T-Rex (Frames) | 5455 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1575 | |
GFXBench 4.0 - Manhattan (Fps) | 3075 | |
GFXBench 4.0 - T-Rex (Fps) | 5455 |
Compare specifications (specs)
Intel Core i5-6500 | Intel Xeon E5-2470 | |
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Essentials |
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Architecture codename | Skylake | Sandy Bridge EN |
Launch date | 5 August 2015 | May 2012 |
Launch price (MSRP) | $192 | $1,480 |
Place in performance rating | 1430 | 1518 |
Price now | $234.38 | $316.72 |
Processor Number | i5-6500 | E5-2470 |
Series | 6th Generation Intel® Core™ i5 Processors | Intel® Xeon® Processor E5 Family |
Status | Launched | Discontinued |
Value for money (0-100) | 9.10 | 9.36 |
Vertical segment | Desktop | Server |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | 2.30 GHz |
Bus Speed | 8 GT/s DMI3 | 8 GT/s QPI |
Die size | 177 mm | 294 mm |
L1 cache | 256 KB | 64 KB (per core) |
L2 cache | 1 MB | 256 KB (per core) |
L3 cache | 6 MB | 20480 KB (shared) |
Manufacturing process technology | 14 nm | 32 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 71°C | 78 °C |
Maximum frequency | 3.60 GHz | 3.10 GHz |
Number of cores | 4 | 8 |
Number of threads | 4 | 16 |
Number of QPI Links | 1 | |
Transistor count | 1270 million | |
VID voltage range | 0.60V-1.35V | |
Memory |
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Max memory channels | 2 | 3 |
Maximum memory bandwidth | 34.1 GB/s | 38.4 GB/s |
Maximum memory size | 64 GB | 384 GB |
Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | DDR3 800/1066/1333/1600 |
ECC memory support | ||
Graphics |
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Device ID | 0x1912 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 530 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | N / A | |
Max resolution over WiDi | 1080p | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 45mm x 42.5 mm |
Sockets supported | FCLGA1151 | FCLGA1356 |
Thermal Design Power (TDP) | 65 Watt | 95 Watt |
Thermal Solution | PCG 2015C (65W) | |
Peripherals |
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Max number of PCIe lanes | 16 | 24 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | 2S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |