Intel Core i7-2655LE vs AMD Phenom II X3 N850

Comparative analysis of Intel Core i7-2655LE and AMD Phenom II X3 N850 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i7-2655LE

AMD Phenom II X3 N850

Differences

Reasons to consider the Intel Core i7-2655LE

1 more threads: 4 vs 3
Around 32% higher clock speed: 2.90 GHz vs 2.2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Around 37% better performance in PassMark - Single thread mark: 1231 vs 898
Around 52% better performance in PassMark - CPU mark: 1999 vs 1318

Specifications (specs)
Number of threads	4 vs 3
Maximum frequency	2.90 GHz vs 2.2 GHz
Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	25 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	1231 vs 898
PassMark - CPU mark	1999 vs 1318

Reasons to consider the AMD Phenom II X3 N850

1 more cores, run more applications at once: 3 vs 2

Number of cores	3 vs 2

Compare benchmarks

CPU 1: Intel Core i7-2655LE
CPU 2: AMD Phenom II X3 N850

PassMark - Single thread mark

CPU 1

CPU 2

1231

898

PassMark - CPU mark

CPU 1

CPU 2

1999

1318

Name	Intel Core i7-2655LE	AMD Phenom II X3 N850
PassMark - Single thread mark	1231	898
PassMark - CPU mark	1999	1318
Geekbench 4 - Single Core		1343
Geekbench 4 - Multi-Core		3130

Compare specifications (specs)

	Intel Core i7-2655LE	AMD Phenom II X3 N850
Essentials
Architecture codename	Sandy Bridge	Champlain
Launch date	Q1'11	4 October 2010
Place in performance rating	2010	2008
Processor Number	i7-2655LE
Series	Legacy Intel® Core™ Processors	3x AMD Phenom II
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	5 GT/s DMI
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 C
Maximum frequency	2.90 GHz	2.2 GHz
Number of cores	2	3
Number of threads	4	3
Front-side bus (FSB)		3600 MHz
L1 cache		384 KB
L2 cache		1.5 MB
Memory
Max memory channels	2
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.00 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	S1 (S1g4)
Thermal Design Power (TDP)	25 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8+2x4
Security & Reliability
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)