Intel Core i7-3517UE vs Intel Celeron M 585

Comparative analysis of Intel Core i7-3517UE and Intel Celeron M 585 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core i7-3517UE

  • CPU is newer: launch date 3 year(s) 9 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 3 more threads: 4 vs 1
  • Around 30% higher clock speed: 2.80 GHz vs 2.16 GHz
  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • Around 82% lower typical power consumption: 17 Watt vs 31 Watt
Launch date June 2012 vs 20 August 2008
Number of cores 2 vs 1
Number of threads 4 vs 1
Maximum frequency 2.80 GHz vs 2.16 GHz
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 22 nm vs 65 nm
Thermal Design Power (TDP) 17 Watt vs 31 Watt

Reasons to consider the Intel Celeron M 585

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
L2 cache 1024 KB vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Core i7-3517UE
CPU 2: Intel Celeron M 585

Name Intel Core i7-3517UE Intel Celeron M 585
PassMark - Single thread mark 1433
PassMark - CPU mark 2384

Compare specifications (specs)

Intel Core i7-3517UE Intel Celeron M 585

Essentials

Architecture codename Ivy Bridge Merom
Launch date June 2012 20 August 2008
Place in performance rating 1785 not rated
Processor Number i7-3517UE 585
Series Legacy Intel® Core™ Processors Legacy Intel® Celeron® Processor
Status Launched Discontinued
Vertical segment Embedded Mobile
Launch price (MSRP) $70

Performance

64 bit support
Base frequency 1.70 GHz 2.16 GHz
Bus Speed 5 GT/s DMI 667 MHz FSB
Die size 118 mm 143 mm2
L1 cache 64 KB (per core)
L2 cache 256 KB (per core) 1024 KB
L3 cache 4096 KB (shared)
Manufacturing process technology 22 nm 65 nm
Maximum core temperature 105°C 100°C
Maximum frequency 2.80 GHz 2.16 GHz
Number of cores 2 1
Number of threads 4 1
Front-side bus (FSB) 667 MHz
Transistor count 291 million
VID voltage range 0.95-1.30V

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 16 GB
Supported memory types DDR3/DDR3L 1333/1600

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 4000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 3
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31mm x 24mm 35mm x 35mm
Sockets supported FCBGA1023 PPGA478
Thermal Design Power (TDP) 17 Watt 31 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16 2x8 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)