Intel Core i7-3960X vs AMD Phenom II X2 550
Comparative analysis of Intel Core i7-3960X and AMD Phenom II X2 550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-3960X
- CPU is newer: launch date 1 year(s) 11 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4 more cores, run more applications at once: 6 vs 2
- Around 26% higher clock speed: 3.90 GHz vs 3.1 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 2.5x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 46% better performance in PassMark - Single thread mark: 1800 vs 1233
- 7.2x better performance in PassMark - CPU mark: 8446 vs 1167
Specifications (specs) | |
Launch date | November 2011 vs November 2009 |
Unlocked | Unlocked vs Locked |
Number of cores | 6 vs 2 |
Maximum frequency | 3.90 GHz vs 3.1 GHz |
Manufacturing process technology | 32 nm vs 45 nm |
L1 cache | 64 KB (per core) vs 128 KB (per core) |
L2 cache | 256 KB (per core) vs 512 KB (per core) |
L3 cache | 15360 KB (shared) vs 6144 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1800 vs 1233 |
PassMark - CPU mark | 8446 vs 1167 |
Reasons to consider the AMD Phenom II X2 550
- Around 63% lower typical power consumption: 80 Watt vs 130 Watt
Thermal Design Power (TDP) | 80 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Core i7-3960X
CPU 2: AMD Phenom II X2 550
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i7-3960X | AMD Phenom II X2 550 |
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PassMark - Single thread mark | 1800 | 1233 |
PassMark - CPU mark | 8446 | 1167 |
Geekbench 4 - Single Core | 821 | |
Geekbench 4 - Multi-Core | 4933 | |
3DMark Fire Strike - Physics Score | 5484 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 6.358 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 27.376 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.727 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.924 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 7.797 |
Compare specifications (specs)
Intel Core i7-3960X | AMD Phenom II X2 550 | |
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Essentials |
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Architecture codename | Sandy Bridge E | Callisto |
Launch date | November 2011 | November 2009 |
Launch price (MSRP) | $861 | $133 |
Place in performance rating | 2065 | 2042 |
Price now | $799.99 | $49.99 |
Processor Number | i7-3960X | |
Series | Intel® Core™ X-series Processors | |
Status | Discontinued | |
Value for money (0-100) | 4.64 | 11.92 |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.30 GHz | |
Bus Speed | 5 GT/s DMI2 | |
Die size | 435 mm | 258 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 15360 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 32 nm | 45 nm |
Maximum case temperature (TCase) | 67 °C | |
Maximum core temperature | 66.8°C | |
Maximum frequency | 3.90 GHz | 3.1 GHz |
Number of cores | 6 | 2 |
Number of threads | 12 | |
Transistor count | 2270 million | 758 million |
Unlocked | ||
VID voltage range | 0.6V-1.35V | |
Memory |
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Max memory channels | 4 | |
Maximum memory bandwidth | 51.2 GB/s | |
Maximum memory size | 64 GB | |
Supported memory types | DDR3 1066/1333/1600 | DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 52.5mm x 45.0mm | |
Sockets supported | FCLGA2011 | AM3 |
Thermal Design Power (TDP) | 130 Watt | 80 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 2.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |