Intel Core i7-620M vs Intel Core 2 Duo T5870

Comparative analysis of Intel Core i7-620M and Intel Core 2 Duo T5870 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i7-620M

Intel Core 2 Duo T5870

Differences

Reasons to consider the Intel Core i7-620M

CPU is newer: launch date 1 year(s) 3 month(s) later
2 more threads: 4 vs 2
Around 67% higher clock speed: 3.33 GHz vs 2 GHz
Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 74% better performance in PassMark - Single thread mark: 1290 vs 740
2.8x better performance in PassMark - CPU mark: 1980 vs 698
Around 81% better performance in Geekbench 4 - Single Core: 452 vs 250
2.2x better performance in Geekbench 4 - Multi-Core: 947 vs 429

Specifications (specs)
Launch date	10 January 2010 vs 1 October 2008
Number of threads	4 vs 2
Maximum frequency	3.33 GHz vs 2 GHz
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	1290 vs 740
PassMark - CPU mark	1980 vs 698
Geekbench 4 - Single Core	452 vs 250
Geekbench 4 - Multi-Core	947 vs 429

Reasons to consider the Intel Core 2 Duo T5870

4x more L2 cache, more data can be stored in the L2 cache for quick access later

L2 cache	2048 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Core i7-620M
CPU 2: Intel Core 2 Duo T5870

PassMark - Single thread mark

CPU 1

CPU 2

1290

740

PassMark - CPU mark

CPU 1

CPU 2

1980

698

Geekbench 4 - Single Core

CPU 1

CPU 2

452

250

Geekbench 4 - Multi-Core

CPU 1

CPU 2

947

429

Name	Intel Core i7-620M	Intel Core 2 Duo T5870
PassMark - Single thread mark	1290	740
PassMark - CPU mark	1980	698
Geekbench 4 - Single Core	452	250
Geekbench 4 - Multi-Core	947	429
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	0.513
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	22.188
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.15
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.762
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	2.197

Compare specifications (specs)

	Intel Core i7-620M	Intel Core 2 Duo T5870
Essentials
Architecture codename	Arrandale	Merom
Launch date	10 January 2010	1 October 2008
Launch price (MSRP)	$332
Place in performance rating	2965	2971
Price now	$110.01
Processor Number	i7-620M	T5870
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Value for money (0-100)	7.29
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.66 GHz	2.00 GHz
Bus Speed	2.5 GT/s DMI	800 MHz FSB
Die size	81 mm2	143 mm2
Front-side bus (FSB)	2500 MHz	800 MHz
L1 cache	64 KB (per core)
L2 cache	512 KB	2048 KB
L3 cache	4096 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	105°C	100°C
Maximum frequency	3.33 GHz	2 GHz
Number of cores	2	2
Number of threads	4	2
Transistor count	382 million	291 million
VID voltage range		1.075V-1.175V
Memory
Max memory channels	2
Maximum memory bandwidth	17.1 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 800/1066
Graphics
Graphics base frequency	500 MHz
Graphics max dynamic frequency	766 MHz
Graphics max frequency	766 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	rPGA 37.5mmx 37.5mm, BGA 34mmx28mm	35mm x 35mm
Sockets supported	BGA1288, PGA988
Thermal Design Power (TDP)	35 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)