Intel Core i7-7700 vs Intel Pentium D 820
Comparative analysis of Intel Core i7-7700 and Intel Pentium D 820 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i7-7700
- CPU is newer: launch date 11 year(s) 8 month(s) later
- 2 more cores, run more applications at once: 4 vs 2
- 6 more threads: 8 vs 2
- Around 50% higher clock speed: 4.20 GHz vs 2.8 GHz
- Around 56% higher maximum core temperature: 100°C vs 64.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 90 nm
- 9.1x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
- 5.9x better performance in Geekbench 4 - Single Core: 1059 vs 179
- 13.2x better performance in Geekbench 4 - Multi-Core: 4044 vs 307
Specifications (specs) | |
Launch date | 3 January 2017 vs May 2005 |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 2 |
Maximum frequency | 4.20 GHz vs 2.8 GHz |
Maximum core temperature | 100°C vs 64.1°C |
Manufacturing process technology | 14 nm vs 90 nm |
L1 cache | 256 KB vs 28 KB |
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 1059 vs 179 |
Geekbench 4 - Multi-Core | 4044 vs 307 |
Reasons to consider the Intel Pentium D 820
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
L2 cache | 2048 KB vs 1 MB |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: Intel Core i7-7700
CPU 2: Intel Pentium D 820
Geekbench 4 - Single Core |
|
|
||||
Geekbench 4 - Multi-Core |
|
|
Name | Intel Core i7-7700 | Intel Pentium D 820 |
---|---|---|
PassMark - Single thread mark | 2447 | |
PassMark - CPU mark | 8644 | |
Geekbench 4 - Single Core | 1059 | 179 |
Geekbench 4 - Multi-Core | 4044 | 307 |
3DMark Fire Strike - Physics Score | 3043 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.912 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 93.066 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.743 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.004 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 7.298 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1967 | |
GFXBench 4.0 - Manhattan (Frames) | 3914 | |
GFXBench 4.0 - T-Rex (Frames) | 6644 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1967 | |
GFXBench 4.0 - Manhattan (Fps) | 3914 | |
GFXBench 4.0 - T-Rex (Fps) | 6644 |
Compare specifications (specs)
Intel Core i7-7700 | Intel Pentium D 820 | |
---|---|---|
Essentials |
||
Architecture codename | Kaby Lake | Smithfield |
Launch date | 3 January 2017 | May 2005 |
Launch price (MSRP) | $303 | |
Place in performance rating | 1119 | 3302 |
Price now | $309.99 | |
Processor Number | i7-7700 | 820 |
Series | 7th Generation Intel® Core™ i7 Processors | Legacy Intel® Pentium® Processor |
Status | Launched | Discontinued |
Value for money (0-100) | 10.22 | |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 3.60 GHz | 2.80 GHz |
Bus Speed | 8 GT/s DMI3 | 800 MHz FSB |
L1 cache | 256 KB | 28 KB |
L2 cache | 1 MB | 2048 KB |
L3 cache | 8 MB | |
Manufacturing process technology | 14 nm | 90 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 100°C | 64.1°C |
Maximum frequency | 4.20 GHz | 2.8 GHz |
Number of cores | 4 | 2 |
Number of QPI Links | 0 | |
Number of threads | 8 | 2 |
Die size | 206 mm2 | |
Front-side bus (FSB) | 800 MHz | |
Transistor count | 230 million | |
VID voltage range | 1.200V-1.400V | |
Memory |
||
Max memory channels | 2 | |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-2133/2400, DDR3L-1333/1600 @ 1.35V | DDR1, DDR2, DDR3 |
Graphics |
||
Device ID | 0x5912 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Graphics max frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 630 | |
Graphics interfaces |
||
Number of displays supported | 3 | |
Graphics image quality |
||
4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
||
DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA1151 | PLGA775 |
Thermal Design Power (TDP) | 65 Watt | 95 Watt |
Thermal Solution | PCG 2015C (65W) | |
Peripherals |
||
Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |