Intel Core i7-870S vs AMD Phenom X3 8650

Comparative analysis of Intel Core i7-870S and AMD Phenom X3 8650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core i7-870S

  • CPU is newer: launch date 2 year(s) 2 month(s) later
  • 1 more cores, run more applications at once: 4 vs 3
  • Around 57% higher clock speed: 3.60 GHz vs 2.3 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 4x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 16% lower typical power consumption: 82 Watt vs 95 Watt
Launch date July 2010 vs April 2008
Number of cores 4 vs 3
Maximum frequency 3.60 GHz vs 2.3 GHz
Manufacturing process technology 45 nm vs 65 nm
L3 cache 8192 KB (shared) vs 2048 KB (shared)
Thermal Design Power (TDP) 82 Watt vs 95 Watt

Reasons to consider the AMD Phenom X3 8650

  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
L1 cache 128 KB (per core) vs 64 KB (per core)
L2 cache 512 KB (per core) vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Core i7-870S
CPU 2: AMD Phenom X3 8650

Name Intel Core i7-870S AMD Phenom X3 8650
PassMark - Single thread mark 1493
PassMark - CPU mark 2765
Geekbench 4 - Single Core 1302
Geekbench 4 - Multi-Core 2991

Compare specifications (specs)

Intel Core i7-870S AMD Phenom X3 8650

Essentials

Architecture codename Lynnfield Toliman
Launch date July 2010 April 2008
Place in performance rating 1711 1704
Processor Number i7-870S
Series Legacy Intel® Core™ Processors
Status Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.66 GHz
Bus Speed 2.5 GT/s DMI
Die size 296 mm2 285 mm
L1 cache 64 KB (per core) 128 KB (per core)
L2 cache 256 KB (per core) 512 KB (per core)
L3 cache 8192 KB (shared) 2048 KB (shared)
Manufacturing process technology 45 nm 65 nm
Maximum frequency 3.60 GHz 2.3 GHz
Number of cores 4 3
Number of threads 8
Transistor count 774 million 450 million
VID voltage range 0.6500V-1.4000V

Memory

Max memory channels 2
Maximum memory bandwidth 21 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported LGA1156 AM2+
Thermal Design Power (TDP) 82 Watt 95 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)