Intel Core i9-10850K vs AMD Ryzen 3 3200GE

Comparative analysis of Intel Core i9-10850K and AMD Ryzen 3 3200GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i9-10850K

  • CPU is newer: launch date 1 year(s) 1 month(s) later
  • 6 more cores, run more applications at once: 10 vs 4
  • 16 more threads: 20 vs 4
  • Around 37% higher clock speed: 5.20 GHz vs 3.8 GHz
  • Around 5% higher maximum core temperature: 100°C vs 95 °C
  • 5x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 39% better performance in PassMark - Single thread mark: 3076 vs 2206
  • 3.1x better performance in PassMark - CPU mark: 22372 vs 7309
Specifications (specs)
Launch date 18 Aug 2020 vs 7 Jul 2019
Number of cores 10 vs 4
Number of threads 20 vs 4
Maximum frequency 5.20 GHz vs 3.8 GHz
Maximum core temperature 100°C vs 95 °C
L3 cache 20 MB vs 4 MB
Benchmarks
PassMark - Single thread mark 3076 vs 2206
PassMark - CPU mark 22372 vs 7309

Reasons to consider the AMD Ryzen 3 3200GE

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
  • 3.6x lower typical power consumption: 35 Watt vs 125 Watt
Unlocked Unlocked vs Locked
Manufacturing process technology 12 nm vs 14 nm
Thermal Design Power (TDP) 35 Watt vs 125 Watt

Compare benchmarks

CPU 1: Intel Core i9-10850K
CPU 2: AMD Ryzen 3 3200GE

PassMark - Single thread mark
CPU 1
CPU 2
3076
2206
PassMark - CPU mark
CPU 1
CPU 2
22372
7309
Name Intel Core i9-10850K AMD Ryzen 3 3200GE
PassMark - Single thread mark 3076 2206
PassMark - CPU mark 22372 7309
3DMark Fire Strike - Physics Score 8789
GFXBench 4.0 - Car Chase Offscreen (Frames) 2107
GFXBench 4.0 - Car Chase Offscreen (Fps) 2107
GFXBench 4.0 - Manhattan (Frames) 1228
GFXBench 4.0 - Manhattan (Fps) 1228
GFXBench 4.0 - T-Rex (Frames) 2139
GFXBench 4.0 - T-Rex (Fps) 2139

Compare specifications (specs)

Intel Core i9-10850K AMD Ryzen 3 3200GE

Essentials

Architecture codename Comet Lake Zen
Launch date 18 Aug 2020 7 Jul 2019
Launch price (MSRP) $453 - $464
Place in performance rating 1116 1123
Processor Number i9-10850K
Series 10th Generation Intel Core i9 Processors
Status Launched
Vertical segment Desktop Desktop
OPN Tray YD3200C6M4MFH

Performance

64 bit support
Base frequency 3.60 GHz 3.3 GHz
Bus Speed 8 GT/s
L3 cache 20 MB 4 MB
Manufacturing process technology 14 nm 12 nm
Maximum core temperature 100°C 95 °C
Maximum frequency 5.20 GHz 3.8 GHz
Number of cores 10 4
Number of threads 20 4
L1 cache 384 KB
L2 cache 2 MB
Number of GPU cores 8
Unlocked

Memory

Max memory channels 2 2
Maximum memory bandwidth 45.8 GB/s
Maximum memory size 128 GB
Supported memory types DDR4-2933 DDR4-2933

Graphics

Device ID 0x9BC5
Graphics base frequency 350 MHz 1200 MHz
Graphics max dynamic frequency 1.20 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel UHD Graphics 630 Radeon Vega 8 Graphics
iGPU core count 8

Graphics interfaces

Number of displays supported 3
DisplayPort
HDMI

Graphics image quality

4K resolution support
Max resolution over DisplayPort 4096x2304@60Hz
Max resolution over eDP 4096x2304@60Hz
Max resolution over HDMI 1.4 4096x2160@30Hz

Graphics API support

DirectX 12
OpenGL 4.5

Compatibility

Configurable TDP-down 95 Watt
Configurable TDP-down Frequency 3.30 GHz
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1200 AM4
Thermal Design Power (TDP) 125 Watt 35 Watt
Thermal Solution PCG 2015D

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)