Intel Pentium 4 HT 531 vs Intel Pentium III 866

Comparative analysis of Intel Pentium 4 HT 531 and Intel Pentium III 866 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Pentium 4 HT 531

  • Around 245% higher clock speed: 3 GHz vs 0.87 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 180 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 3 GHz vs 0.87 GHz
Manufacturing process technology 90 nm vs 180 nm
L1 cache 16 KB vs 8 KB
L2 cache 1024 KB vs 256 KB

Reasons to consider the Intel Pentium III 866

  • Around 18% higher maximum core temperature: 80°C vs 67.7°C
  • 3.2x lower typical power consumption: 26.1 Watt vs 84 Watt
Maximum core temperature 80°C vs 67.7°C
Thermal Design Power (TDP) 26.1 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 531
CPU 2: Intel Pentium III 866

Name Intel Pentium 4 HT 531 Intel Pentium III 866
Geekbench 4 - Single Core 168
Geekbench 4 - Multi-Core 214
PassMark - Single thread mark 202
PassMark - CPU mark 152

Compare specifications (specs)

Intel Pentium 4 HT 531 Intel Pentium III 866

Essentials

Architecture codename Prescott Coppermine T
Launch date June 2005 Q1'00
Place in performance rating 3299 3293
Processor Number 531
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.00 GHz 866 MHz
Bus Speed 800 MHz FSB 133 MHz FSB
Die size 112 mm2 80 mm
L1 cache 16 KB 8 KB
L2 cache 1024 KB 256 KB
Manufacturing process technology 90 nm 180 nm
Maximum core temperature 67.7°C 80°C
Maximum frequency 3 GHz 0.87 GHz
Number of cores 1 1
Transistor count 125 million 44 million
VID voltage range 1.200V-1.425V 1.75V
Maximum case temperature (TCase) 69 °C

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported PLGA775 PPGA370, SECC2, SECC2495
Thermal Design Power (TDP) 84 Watt 26.1 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)