Intel Pentium 4 HT 630 vs Intel Celeron 2.10

Comparative analysis of Intel Pentium 4 HT 630 and Intel Celeron 2.10 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium 4 HT 630

Intel Celeron 2.10

Differences

Reasons to consider the Intel Pentium 4 HT 630

CPU is newer: launch date 2 year(s) 3 month(s) later
Around 43% higher clock speed: 3 GHz vs 2.1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
3.5x more L1 cache, more data can be stored in the L1 cache for quick access later
16x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	February 2005 vs November 2002
Maximum frequency	3 GHz vs 2.1 GHz
Manufacturing process technology	90 nm vs 130 nm
L1 cache	28 KB vs 8 KB
L2 cache	2048 KB vs 128 KB

Reasons to consider the Intel Celeron 2.10

Around 4% higher maximum core temperature: 69°C vs 66.6°C
Around 50% lower typical power consumption: 55.5 Watt vs 84 Watt

Maximum core temperature	69°C vs 66.6°C
Thermal Design Power (TDP)	55.5 Watt vs 84 Watt

Compare benchmarks

CPU 1: Intel Pentium 4 HT 630
CPU 2: Intel Celeron 2.10

Name	Intel Pentium 4 HT 630	Intel Celeron 2.10
Geekbench 4 - Single Core	168
Geekbench 4 - Multi-Core	214
PassMark - Single thread mark		0
PassMark - CPU mark		244

Compare specifications (specs)

	Intel Pentium 4 HT 630	Intel Celeron 2.10
Essentials
Architecture codename	Prescott	Northwood
Launch date	February 2005	November 2002
Place in performance rating	3300	3348
Processor Number	630
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	2.10 GHz
Bus Speed	800 MHz FSB	400 MHz FSB
Die size	135 mm2	131 mm2
L1 cache	28 KB	8 KB
L2 cache	2048 KB	128 KB
Manufacturing process technology	90 nm	130 nm
Maximum core temperature	66.6°C	69°C
Maximum frequency	3 GHz	2.1 GHz
Number of cores	1	1
Transistor count	169 million	55 million
VID voltage range	1.200V-1.400V	1.315V-1.525V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	35mm x 35mm
Sockets supported	PLGA775	PPGA478
Thermal Design Power (TDP)	84 Watt	55.5 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)