Intel Pentium 4 HT 661 vs Intel Pentium D 930
Comparative analysis of Intel Pentium 4 HT 661 and Intel Pentium D 930 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium 4 HT 661
- Around 20% higher clock speed: 3.6 GHz vs 3 GHz
- Around 10% lower typical power consumption: 86 Watt vs 95 Watt
Maximum frequency | 3.6 GHz vs 3 GHz |
Thermal Design Power (TDP) | 86 Watt vs 95 Watt |
Reasons to consider the Intel Pentium D 930
- 1 more cores, run more applications at once: 2 vs 1
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 2 vs 1 |
L2 cache | 4096 KB vs 2048 KB |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: Intel Pentium 4 HT 661
CPU 2: Intel Pentium D 930
Name | Intel Pentium 4 HT 661 | Intel Pentium D 930 |
---|---|---|
Geekbench 4 - Single Core | 198 | |
Geekbench 4 - Multi-Core | 341 |
Compare specifications (specs)
Intel Pentium 4 HT 661 | Intel Pentium D 930 | |
---|---|---|
Essentials |
||
Architecture codename | Cedarmill | Presler |
Launch date | January 2006 | January 2006 |
Place in performance rating | not rated | 3284 |
Processor Number | 661 | 930 |
Series | Legacy Intel® Pentium® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 3.60 GHz | 3.00 GHz |
Bus Speed | 800 MHz FSB | 800 MHz FSB |
Die size | 81 mm2 | 162 mm2 |
L1 cache | 28 KB | 28 KB |
L2 cache | 2048 KB | 4096 KB |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | B1+C1=69°C, D0=64.4°C | 63.4°C |
Maximum frequency | 3.6 GHz | 3 GHz |
Number of cores | 1 | 2 |
Transistor count | 188 million | 376 million |
VID voltage range | 1.200V-1.3375V | 1.200V-1.3375V |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | DDR1, DDR2, DDR3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | PLGA775 |
Thermal Design Power (TDP) | 86 Watt | 95 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | 32-bit |
Thermal Monitoring | ||
Intel® AES New Instructions | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |