Intel Pentium D 950 vs Intel Pentium 4 HT 530

Comparative analysis of Intel Pentium D 950 and Intel Pentium 4 HT 530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium D 950

Intel Pentium 4 HT 530

Differences

Reasons to consider the Intel Pentium D 950

CPU is newer: launch date 1 year(s) 7 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 13% higher clock speed: 3.4 GHz vs 3 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	January 2006 vs June 2004
Number of cores	2 vs 1
Maximum frequency	3.4 GHz vs 3 GHz
Manufacturing process technology	65 nm vs 90 nm
L1 cache	28 KB vs 16 KB
L2 cache	4096 KB vs 1024 KB
Max number of CPUs in a configuration	2 vs 1

Reasons to consider the Intel Pentium 4 HT 530

Around 55% lower typical power consumption: 84 Watt vs 130 Watt

Thermal Design Power (TDP)	84 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Pentium D 950
CPU 2: Intel Pentium 4 HT 530

Name	Intel Pentium D 950	Intel Pentium 4 HT 530
PassMark - Single thread mark	695
PassMark - CPU mark	681
Geekbench 4 - Single Core	220
Geekbench 4 - Multi-Core	389

Compare specifications (specs)

	Intel Pentium D 950	Intel Pentium 4 HT 530
Essentials
Architecture codename	Presler	Prescott
Launch date	January 2006	June 2004
Place in performance rating	3051	not rated
Processor Number	950
Series	Legacy Intel® Pentium® Processor
Status	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.40 GHz
Bus Speed	800 MHz FSB
Die size	162 mm2	109 mm
L1 cache	28 KB	16 KB
L2 cache	4096 KB	1024 KB
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	C1+D0=63.4°C, B1=68.6°C
Maximum frequency	3.4 GHz	3 GHz
Number of cores	2	1
Transistor count	376 million	125 million
VID voltage range	1.200V-1.3375V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	37.5mm x 37.5mm
Sockets supported	PLGA775	775
Thermal Design Power (TDP)	130 Watt	84 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)