Intel Pentium D 960 vs Intel Pentium 4 511

Comparative analysis of Intel Pentium D 960 and Intel Pentium 4 511 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium D 960

  • CPU is newer: launch date 1 year(s) 3 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • Around 29% higher clock speed: 3.6 GHz vs 2.8 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date May 2006 vs January 2005
Number of cores 2 vs 1
Maximum frequency 3.6 GHz vs 2.8 GHz
Manufacturing process technology 65 nm vs 90 nm
L1 cache 28 KB vs 16 KB
L2 cache 4096 KB vs 1024 KB
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the Intel Pentium 4 511

  • Around 55% lower typical power consumption: 84 Watt vs 130 Watt
Thermal Design Power (TDP) 84 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Pentium D 960
CPU 2: Intel Pentium 4 511

Name Intel Pentium D 960 Intel Pentium 4 511
PassMark - Single thread mark 782
PassMark - CPU mark 807
Geekbench 4 - Single Core 781
Geekbench 4 - Multi-Core 899

Compare specifications (specs)

Intel Pentium D 960 Intel Pentium 4 511

Essentials

Architecture codename Presler Prescott
Launch date May 2006 January 2005
Place in performance rating 2490 2479
Processor Number 960 511
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.60 GHz 2.80 GHz
Bus Speed 800 MHz FSB 533 MHz FSB
Die size 162 mm2 112 mm2
L1 cache 28 KB 16 KB
L2 cache 4096 KB 1024 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature C1=68.6°C, D0=63.4°C 67.7°C
Maximum frequency 3.6 GHz 2.8 GHz
Number of cores 2 1
Transistor count 376 million 125 million
VID voltage range 1.200V-1.3375V 1.25V-1.400V

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 37.5mm x 37.5mm
Sockets supported PLGA775 PLGA775
Thermal Design Power (TDP) 130 Watt 84 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)