Intel Pentium Dual-Core E2210 vs Intel Celeron Dual-Core T3000
Comparative analysis of Intel Pentium Dual-Core E2210 and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium Dual-Core E2210
- CPU is newer: launch date 1 month(s) later
- Around 22% higher clock speed: 2.2 GHz vs 1.8 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 30% better performance in PassMark - Single thread mark: 946 vs 728
Specifications (specs) | |
Launch date | June 2009 vs 1 May 2009 |
Maximum frequency | 2.2 GHz vs 1.8 GHz |
L1 cache | 64 KB (per core) vs 64 KB |
Benchmarks | |
PassMark - Single thread mark | 946 vs 728 |
Reasons to consider the Intel Celeron Dual-Core T3000
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
- Around 54% better performance in PassMark - CPU mark: 1084 vs 702
Specifications (specs) | |
Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Benchmarks | |
PassMark - CPU mark | 1084 vs 702 |
Compare benchmarks
CPU 1: Intel Pentium Dual-Core E2210
CPU 2: Intel Celeron Dual-Core T3000
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Pentium Dual-Core E2210 | Intel Celeron Dual-Core T3000 |
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PassMark - Single thread mark | 946 | 728 |
PassMark - CPU mark | 702 | 1084 |
Geekbench 4 - Single Core | 219 | |
Geekbench 4 - Multi-Core | 377 |
Compare specifications (specs)
Intel Pentium Dual-Core E2210 | Intel Celeron Dual-Core T3000 | |
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Essentials |
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Architecture codename | Wolfdale | Penryn-1M |
Launch date | June 2009 | 1 May 2009 |
Place in performance rating | 2367 | 3007 |
Vertical segment | Desktop | Laptop |
Series | Intel Celeron Dual-Core | |
Performance |
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64 bit support | ||
Die size | 82 mm | 107 mm |
L1 cache | 64 KB (per core) | 64 KB |
L2 cache | 1024 KB (shared) | 1024 KB |
Manufacturing process technology | 45 nm | 45 nm |
Maximum frequency | 2.2 GHz | 1.8 GHz |
Number of cores | 2 | 2 |
Transistor count | 228 million | 410 Million |
Front-side bus (FSB) | 800 MHz | |
Number of threads | 2 | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Sockets supported | 775 | P (478) |
Thermal Design Power (TDP) | 65 Watt | 35 Watt |