Intel Pentium E5700 vs Intel Pentium 4 HT 640

Comparative analysis of Intel Pentium E5700 and Intel Pentium 4 HT 640 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium E5700

  • CPU is newer: launch date 5 year(s) 6 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • Around 11% higher maximum core temperature: 74.1°C vs 66.6°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 90 nm
  • 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 29% lower typical power consumption: 65 Watt vs 84 Watt
Launch date August 2010 vs February 2005
Number of cores 2 vs 1
Maximum core temperature 74.1°C vs 66.6°C
Manufacturing process technology 45 nm vs 90 nm
L1 cache 64 KB (per core) vs 28 KB
Thermal Design Power (TDP) 65 Watt vs 84 Watt

Reasons to consider the Intel Pentium 4 HT 640

  • Around 7% higher clock speed: 3.2 GHz vs 3 GHz
Maximum frequency 3.2 GHz vs 3 GHz

Compare benchmarks

CPU 1: Intel Pentium E5700
CPU 2: Intel Pentium 4 HT 640

Name Intel Pentium E5700 Intel Pentium 4 HT 640
PassMark - Single thread mark 1186
PassMark - CPU mark 1085
Geekbench 4 - Single Core 343
Geekbench 4 - Multi-Core 583

Compare specifications (specs)

Intel Pentium E5700 Intel Pentium 4 HT 640

Essentials

Architecture codename Wolfdale Prescott
Launch date August 2010 February 2005
Launch price (MSRP) $110
Place in performance rating 2595 not rated
Price now $14.99
Processor Number E5700 640
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Value for money (0-100) 34.17
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.00 GHz 3.20 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 82 mm2 135 mm2
L1 cache 64 KB (per core) 28 KB
L2 cache 2048 KB (shared) 2048 KB
Manufacturing process technology 45 nm 90 nm
Maximum core temperature 74.1°C 66.6°C
Maximum frequency 3 GHz 3.2 GHz
Number of cores 2 1
Transistor count 228 million 169 million
VID voltage range 0.8500V-1.3625V 1.200V-1.400V

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported LGA775 PLGA775
Thermal Design Power (TDP) 65 Watt 84 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)