Intel Pentium G3440T vs Intel Pentium G630T
Comparative analysis of Intel Pentium G3440T and Intel Pentium G630T processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium G3440T
- Around 2% higher maximum core temperature: 66.4°C vs 65.0°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 55% better performance in PassMark - Single thread mark: 1615 vs 1042
- 2x better performance in PassMark - CPU mark: 2107 vs 1032
| Specifications (specs) | |
| Maximum core temperature | 66.4°C vs 65.0°C |
| Manufacturing process technology | 22 nm vs 32 nm |
| Benchmarks | |
| PassMark - Single thread mark | 1615 vs 1042 |
| PassMark - CPU mark | 2107 vs 1032 |
Compare benchmarks
CPU 1: Intel Pentium G3440T
CPU 2: Intel Pentium G630T
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
| Name | Intel Pentium G3440T | Intel Pentium G630T |
|---|---|---|
| PassMark - Single thread mark | 1615 | 1042 |
| PassMark - CPU mark | 2107 | 1032 |
| Geekbench 4 - Single Core | 1961 | |
| Geekbench 4 - Multi-Core | 3210 |
Compare specifications (specs)
| Intel Pentium G3440T | Intel Pentium G630T | |
|---|---|---|
Essentials |
||
| Architecture codename | Haswell | Sandy Bridge |
| Launch date | Q2'14 | September 2011 |
| Place in performance rating | 1618 | 1647 |
| Processor Number | G3440T | G630T |
| Series | Intel® Pentium® Processor G Series | Legacy Intel® Pentium® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $80 | |
| Price now | $79.99 | |
| Value for money (0-100) | 7.82 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.80 GHz | 2.30 GHz |
| Bus Speed | 5 GT/s DMI2 | 5 GT/s DMI |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 66.4°C | 65.0°C |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| Die size | 131 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 3072 KB (shared) | |
| Maximum frequency | 2.3 GHz | |
| Transistor count | 504 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 25.6 GB/s | 17 GB/s |
| Maximum memory size | 32 GB | 32 GB |
| Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 1066 |
Graphics |
||
| Graphics base frequency | 200 MHz | 650 MHz |
| Graphics max dynamic frequency | 1.10 GHz | 1.10 GHz |
| Intel® Clear Video HD technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 1.7 GB | |
| Processor graphics | Intel HD Graphics | Intel HD Graphics |
| Graphics max frequency | 1.1 GHz | |
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 2 |
| VGA | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| Max resolution over DisplayPort | 2560x1600@60Hz | |
| Max resolution over eDP | 2560x1600@60Hz | |
| Max resolution over HDMI 1.4 | 1920x1080@60Hz | |
| Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
||
| DirectX | 11.1/12 | |
| OpenGL | 4.3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA1150 | FCLGA1155 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Thermal Solution | PCG 2013A | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | Up to 3.0 | 2.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
