Intel Pentium Gold G6500T vs AMD Ryzen 7 3800X
Comparative analysis of Intel Pentium Gold G6500T and AMD Ryzen 7 3800X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Pentium Gold G6500T
- 3x lower typical power consumption: 35 Watt vs 105 Watt
Thermal Design Power (TDP) | 35 Watt vs 105 Watt |
Reasons to consider the AMD Ryzen 7 3800X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 6 more cores, run more applications at once: 8 vs 2
- 12 more threads: 16 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 8x more L3 cache, more data can be stored in the L3 cache for quick access later
Unlocked | Unlocked vs Locked |
Number of cores | 8 vs 2 |
Number of threads | 16 vs 4 |
Manufacturing process technology | 7 nm vs 14 nm |
L3 cache | 32 MB vs 4 MB |
Compare benchmarks
CPU 1: Intel Pentium Gold G6500T
CPU 2: AMD Ryzen 7 3800X
Name | Intel Pentium Gold G6500T | AMD Ryzen 7 3800X |
---|---|---|
PassMark - Single thread mark | 2238 | |
PassMark - CPU mark | 3874 | |
Geekbench 4 - Single Core | 1283 | |
Geekbench 4 - Multi-Core | 9002 | |
3DMark Fire Strike - Physics Score | 6196 |
Compare specifications (specs)
Intel Pentium Gold G6500T | AMD Ryzen 7 3800X | |
---|---|---|
Essentials |
||
Architecture codename | Comet Lake | Zen 2 |
Launch date | Q2'20 | 7 July 2019 |
Launch price (MSRP) | $75 | $399 |
Place in performance rating | 1158 | 1154 |
Processor Number | G6500T | |
Series | Intel Pentium Gold Processor Series | |
Status | Launched | |
Vertical segment | Desktop | Desktop |
Family | Ryzen 7 | |
OPN PIB | 100-100000025BOX | |
OPN Tray | 100-000000025 | |
Performance |
||
64 bit support | ||
Base frequency | 3.50 GHz | 3.9 GHz |
Bus Speed | 8 GT/s | |
L3 cache | 4 MB | 32 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 100°C | |
Number of cores | 2 | 8 |
Number of threads | 4 | 16 |
L1 cache | 512 KB | |
L2 cache | 4 MB | |
Maximum frequency | 4.5 GHz | |
Unlocked | ||
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 41.6 GB/s | |
Maximum memory size | 128 GB | |
Supported memory types | DDR4-2666 | DDR4-3200 |
Supported memory frequency | 3200 MHz | |
Graphics |
||
Device ID | 0x9BC8 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics 630 | |
Graphics interfaces |
||
Number of displays supported | 3 | |
Graphics image quality |
||
4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
||
DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
||
Configurable TDP-down | 25 Watt | |
Configurable TDP-down Frequency | 2.40 GHz | |
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1200 | AM4 |
Thermal Design Power (TDP) | 35 Watt | 105 Watt |
Thermal Solution | PCG 2015B | |
Peripherals |
||
Max number of PCIe lanes | 16 | 24 |
PCI Express revision | 3.0 | 4.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | x16 |
Scalability | 1S Only | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |