Intel Pentium SU2700 vs Intel Mobile Pentium 4 3.06

Comparative analysis of Intel Pentium SU2700 and Intel Mobile Pentium 4 3.06 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium SU2700

  • CPU is newer: launch date 6 year(s) 2 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
  • 8x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 7x lower typical power consumption: 10 Watt vs 70 Watt
Launch date 1 August 2009 vs June 2003
Manufacturing process technology 45 nm vs 130 nm
L1 cache 64 KB vs 8 KB
L2 cache 2 MB vs 512 KB
Thermal Design Power (TDP) 10 Watt vs 70 Watt

Reasons to consider the Intel Mobile Pentium 4 3.06

  • Around 136% higher clock speed: 3.07 GHz vs 1.3 GHz
  • Around 37% better performance in PassMark - Single thread mark: 657 vs 480
  • Around 52% better performance in PassMark - CPU mark: 347 vs 228
Specifications (specs)
Maximum frequency 3.07 GHz vs 1.3 GHz
Benchmarks
PassMark - Single thread mark 657 vs 480
PassMark - CPU mark 347 vs 228

Compare benchmarks

CPU 1: Intel Pentium SU2700
CPU 2: Intel Mobile Pentium 4 3.06

PassMark - Single thread mark
CPU 1
CPU 2
480
657
PassMark - CPU mark
CPU 1
CPU 2
228
347
Name Intel Pentium SU2700 Intel Mobile Pentium 4 3.06
PassMark - Single thread mark 480 657
PassMark - CPU mark 228 347
Geekbench 4 - Single Core 849
Geekbench 4 - Multi-Core 802

Compare specifications (specs)

Intel Pentium SU2700 Intel Mobile Pentium 4 3.06

Essentials

Architecture codename Penryn Northwood
Launch date 1 August 2009 June 2003
Place in performance rating 2754 2771
Series Intel Pentium
Vertical segment Laptop Laptop

Performance

64 bit support
Die size 107 mm 131 mm
Front-side bus (FSB) 800 MHz
L1 cache 64 KB 8 KB
L2 cache 2 MB 512 KB
Manufacturing process technology 45 nm 130 nm
Maximum frequency 1.3 GHz 3.07 GHz
Number of cores 1 1
Number of threads 1
Transistor count 410 Million 55 million
Maximum case temperature (TCase) 74 °C

Memory

Supported memory types DDR3 DDR1, DDR2

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported soldered 478
Thermal Design Power (TDP) 10 Watt 70 Watt

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel® Hyper-Threading technology